Memory Packaging Engineer - Next-Gen High-Density Packages
$181.1k - $318.4kApple Oakbrook
Apple Inc. is seeking a seasoned Memory Packaging Engineer in Santa Clara, California. This pivotal role involves defining and developing next-generation memory packages for Apple's hardware, collaborating with cross-functional teams, and driving vendor partnerships. The ideal candidate will have over 10 years of experience in packaging technologies and a relevant degree. Apple offers competitive compensation between $181,100 and $318,400 along with comprehensive benefits, including medical coverage and employee stock purchase opportunities. #J-18808-Ljbffr
Vacancy posted 1 day ago
Similar jobs that could be interesting for youBased on the Memory Packaging Engineer - Next-Gen High-Density Packages in Santa Clara, CA vacancy
$181.1k - $318.4k
...team at the heart of memory innovation for every Apple... ...product. As a Memory Packaging Engineer, you will architect... ...boundaries of bandwidth density, power efficiency, and... ...and qualification of next‑generation memory packages... ...development of high‑bandwidth and high‑density...SuggestedWork experience placementRelocationApple
Santa Clara, CA14 hours ago- ...Size: +100 employees Industry: High-Tech / Emerging Infrastructure... ...looking for a smart, driven engineering professional to join our infrastructure... .... About the role: As a SI/PI Package Design Engineer focused on 224... ...role is critical in enabling next‑generation ultra‑high‑speed...SuggestedFull time
- ...Change the world. Love your job. The Emerging Packaging and Test Team at Texas Instruments is... ...groups and functions. You'll have high visibility on your projects, with strong... ...passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules...SuggestedWorldwide
Texas Instruments
Santa Clara, CA13 hours ago $160k - $220k
...A stealth-mode semiconductor startup is seeking an Advanced Packaging Engineer to design advanced semiconductor packages and validate signal... ..., proficiency in SI/PI simulation tools, and experience with high-speed interfaces. You'll work closely across teams to ensure...SuggestedDelos Data
Palo Alto, CA14 hours ago- ...among thousands of GPUs and memory units. The company's SuperSwitch... ...-low power consumption, high radix, compact chip-scale design... ...skilled and experienced Packaging Design Engineer to own bump-bond, die-... ...adhesive, and fiber-attach for our next-generation silicon photonics...SuggestedContract work
nEye.ai
Santa Clara, CA23 days ago $136k - $212.75k
Responsibilities Collaborate with Technical Package Lead and different design teams in the... ...and electrical design issues. Design high speed/density ASIC packages. Perform substrate... .... Requirements Hold a B.S. Electrical Engineering or equivalent experience. 5+ years experience...$181.1k - $318.4k
...accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! Description You will be responsible for IC... ...(FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo...RelocationOverseas- ...Position Overview We are seeking a highly motivated Chiplet Package Design Engineer to drive the development of advanced packaging solutions for next-generation semiconductor products. This... ...and routing for high-speed/high-density interconnects (e.g., HBM, UCIe, PCIe...Full time
Rapidus Corporation US
Santa Clara, CA2 days ago $134.39k - $201.3k
...Generative Ai Engineer Marvell's semiconductor solutions... ...bandwidth, memory bandwidth, and memory capacity... ...Photonic Fabric™ is the next-generation interconnect... ...to the development and packaging of optical components and... ...to packaging and high-volume manufacturing....Permanent employmentInternshipWork from homeShift workMarvell
Santa Clara, CA2 days ago- ...leading MEMS technology company located in Santa Clara, CA is seeking a Sr. Engineer specializing in MEMS Assembly. The ideal candidate will leverage their technical skills to advance MEMS packaging technologies for groundbreaking timing solutions. Responsibilities...
- ...infrastructure—from data centers to next generation cloud and AI... ...takes more than great engineering—it takes a team of... ...is seeking a Senior IC Packaging Engineer to provide... ..., and who thrives in high-ambiguity, high-impact... ...expertise for SoCs, ASICs, or memory products. Deep hands...
Axiado
San Jose, CA22 days ago - ...Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation... ...in semiconductor design focused on advanced IC packaging and high‑speed interconnect technologies. In the role, you will have...Full time
Fidelis Companies
Santa Clara, CA1 day ago - ...Job Description Job Description Salary: Packaging Engineer Nexthop Systems Inc. is seeking a skilled Packaging Engineer... ...design, validation & procurement of product packaging for our next-generation, high-capacity networking systems for emerging AI...
Nexthop Systems Inc
Santa Clara, CAa month ago $138k - $190k
...A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a...Full timeApplied Materials
Santa Clara, CA14 hours ago$138k - $190k
...Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations:... ...materials science and engineering to create next generation technology, join us to... ...technologies. This role focuses on enabling high‐performance optical interconnects and...Full timeWork at officeRelocationApplied Materials
Santa Clara, CA13 hours ago$124k - $195.5k
...an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG)... ..., you will contribute to the next era of computing, driven by AI and pioneering... ...This role is ideal for someone who is highly motivated and committed to achieving flawless...- ...today’s needs and tomorrow’s next big ideas. With a rich... ...innovations in Flash and advanced memory technologies, our solutions... ...and analytical Technologist, Packaging Engineering to join our team in Milpitas... ..., and cost‑effective high‑volume introduction of new package...Contract workTemporary workWork experience placementRemote workWorldwideFlexible hoursShift work
Sandisk
Milpitas, CA16 days ago - ...your career with us! Mechanical Engineer ( AI & Data Center Optical... ...support the design and development of next-generation high-speed optical modules for AI and... ...advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including...Contract workFlexible hours
Lumentum Operations LLC
San Jose, CA6 days ago $144k - $209k
...Sunnyvale, CA, USA Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial... ...worldwide. Your expertise will shape the next generation of hardware experiences, delivering... ...designed specifically for complex, high-value, and shock-sensitive hardware...Full timeWorldwide$160k - $210k
A leading technology company in Sunnyvale is looking for a highly motivated individual for a full-time role in designing packaging solutions for micro-optic assemblies. This position requires a strong background in photonic packaging design, optical simulation software,...Full time$144k - $209k
Google Inc. in Sunnyvale is seeking a Packaging Design Engineer to lead the development of innovative packaging solutions for high-value hardware. This role involves collaborating with diverse teams to ensure designs are efficient, sustainable, and meet stringent safety...$185k - $230k
...Role Overview As a Principal Package Thermal & Mechanical Engineer at Astera Labs, you will serve as... ...packaging solutions that enable next-generation AI and high-performance connectivity systems... ...level integration Analyze power density, hotspot behavior, and package-to...Full timeFlexible hours- ...Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer... ...to play a critical role in customer success for next-generation chiplet platforms Work at the intersection...Full time
Rapidus Corporation US
Santa Clara, CA2 days ago - Nexthop Systems Inc in Santa Clara is seeking a skilled Packaging Engineer to lead packaging design and validation for high-capacity networking systems aimed at AI infrastructures. This role combines technical expertise and innovative problem-solving, ensuring that packaging...
$160k - $210k
...communication to transmit data at super high speeds through the air as a very narrow,... ...successful candidate will design and implement packaging solutions for micro-optic assemblies of... ...you should have M.S. in Electrical Engineering, Applied Physics or related field Five...Full time- ...integration, empowering the creation of high-performance silicon chips and... ...: You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track... ...Synopsys and its customers to deliver next‑generation, high‑performance...Remote work
$141.3k - $226k
...Substrate/Package Layout Engineer page is loaded## Substrate/Package Layout Engineerlocations: USA-California-San Jose-1320 Ridder Park Drivetime... ...of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Calibre/Klayout...Local areaBroadcom Corporation
San Jose, CA14 hours ago$141.3k - $226k
...semiconductor company in San Jose is looking for an IC Substrate and Package Layout Engineer. The ideal candidate will design and layout advanced... ..., collaborating with cross-functional teams to ensure high-performance results. This role requires expertise with Cadence...Broadcom Corporation
San Jose, CA14 hours ago- ...NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal... ...have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools. This position is based in...
NVIDIA Gruppe
Santa Clara, CA15 hours ago - ...interconnects to scalable photonic engines, Lumilens is unlocking a new era... .... At Lumilens, we’re developing high-speed photonics products purpose-... ...We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation of high‑performance packaging...Local area
Lumilens
San Jose, CA15 hours ago
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Memory Packaging Engineer - Next-Gen High-Density Packages. Be the first to apply!
Related searches
- semiconductor packaging engineer Santa Clara, CA
- senior packaging engineer Santa Clara, CA
- sr. packaging engineer Santa Clara, CA
- packaging engineer Santa Clara, CA
- semiconductor packaging engineer
- senior packaging engineer
- medical packaging engineer
- principal packaging engineer
- tesla packaging engineer
- vehicle packaging engineer