Senior Process Engineer

Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CA A rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications . We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes , particularly Flip Chip and Thermo-Compression Bonding (TCB) . What you’ll be doing: Develop and optimise optoelectronic assembly processes Lead Flip Chip and TCB process development Support 2.5D/3D packaging integration Work with suppliers and manufacturing partners to scale processes Design and execute DOE to improve yield and performance Monitor process health, including yield and failure Pareto trends Develop SOWs and project plans for new process development What we’re looking for: 5+ years' experience in manufacturing/process engineering Strong expertise in Flip Chip and Thermo-Compression Bonding Experience with 2.5D/3D packaging and reliability challenges Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar Experience with FMEA Understanding of optoelectronic devices and packaging reliability Knowledge of microelectronics/photonics packaging processes Bachelor's degree in Engineering, Physics or a related discipline Comfortable working in a fast-paced, high-growth environment This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing. Salary: $160,000–$190,000 + Equity + Full Benefits Package #J-18808-Ljbffr Langham Recruitment