Technical Program Manager II- #26-27837

Duration:12 Months contract Schedule: Work outside standard hours to accommodate collaboration with APAC vendors. Job Description: This role supports a business group focused on developing next-generation AR wearable devices. The team is driving innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors. The need arises from increased project volume and the complexity of integrating new electrical components into wearable products. Responsibilities: Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components. End-to-end ownership of PCB fabrication, including schematics, layouts, and form development through to execution and vendor approval for part fabrication. Experience in wearables, especially AR wearables and small electrical components. Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production. Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards. Gather feedback, track schedules, and highlight risks throughout the development process. Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield. Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships. Experience: Minimum 5 years in electrical design, PCB development, or related hardware engineering roles. Experience in wearables or consumer electronics preferred. Skillsets: Electrical - experience with development of PCBAs and flexible circuits. Build matrix - building design. Working with vendors in Asia Pacific region. Design for manufacturability and working with design engineers, familiarity with layout, schematic. Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production. Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization. Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness. Education: Degree in Electrical Engineering or related field preferred, but not required. Relevant experience is more important than formal education. Additional Qualifications: Experience with AR wearable device development. Familiarity with small electrical component integration in compact form factors. Knowledge of advanced PCB fabrication techniques and materials. US Tech Solutions is a global staff augmentation firm providing a wide range of talent on-demand and total workforce solutions. To know more about US Tech Solutions, please visit US Tech Solutions is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, colour, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. AI Statement: By applying, you acknowledge that AI-assisted tools may be used during hiring. #J-18808-Ljbffr US Tech Solutions