CLAWS Packaging Engineer

CLAWS Packaging Engineer Job Location: Raleigh, NC Work Schedule: Monday - Friday, 8am - 5pm About the Department North Carolina State University is leading the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS). This initiative, part of the larger $238 million investment through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, aims to revolutionize the field of wide bandgap semiconductors. Hub leadership, Distinguished Professors John Muth and Fred Kish, are dedicated to the “lab to fab” journey—translating laboratory advancements into fabrication capabilities for wide bandgap semiconductors. The hub brings together a dynamic partnership with N.C. A&T State University and industry leaders, including Wolfspeed, Coherent Corp., General Electric, Bluglass, Adroit Materials, and Kyma Technologies, Inc. This collaborative effort will propel the development of semiconductors crucial for national defense, electric vehicles, power grid technologies, 5G/6G, quantum technologies, and artificial intelligence applications. Wolfpack Perks and Benefits As a Pack member, you belong here, and enjoy exclusive perks designed to enhance your personal and professional well-being. What we offer: Medical, Dental, Vision Flexible Spending Account Retirement Programs Disability Plans Life Insurance Accident Plan Paid Time Off and Other Leave Programs 12 Holidays Each Year Tuition and Academic Assistance And so much more! Attain Work-life balance with our Childcare benefits, Wellness & Recreation Membership, and Wellness Programs that aim to build a thriving wolfpack community. Essential Job Duties We are seeking an experienced semiconductor device Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices and integrated circuits. The ideal candidate will have expertise in the development and integration of packaging processes as well as package design and assembly. The engineer will work closely with device, process, and test engineers to define interconnect strategies, perform thermal and mechanical analysis, and ensure compatibility with wafer-level processes and test infrastructure. Key Responsibilities Lead packaging of wide bandgap semiconductor devices (30%) RF devices including HEMTs and MMICs High power electronic devices including HEMTs, FETs, and diodes Visible spectrum optoelectronic devices and Photonic Integrated Circuits. Packaging Design and Assembly Workflows (25%) Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams. Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules. Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability. Process Integration (25%) Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation. Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data. Troubleshoot process integration challenges related to defectivity, yield, and reliability. Cross-functional Collaboration (20%) Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages. Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks. Other Responsibilities The successful candidate will: Comply with stated workplace policies. Communicate results, plans, and other updates to a variety of audiences. Adhere to and mentor others in known best practices. Support CLAWS activities such as tours, meetings, and conferences. Minimum Education and Experience Ph.D. or relevant terminal degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; or Master’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 5 years of experience in high power, RF, or photonics device packaging and process integration (industry or research). Bachelor’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 8 years of experience in high power, RF, or photonics device packaging and process integration (industry or research). Other Required Qualifications Experience designing and implementing packaging processes for high power, RF, or photonics applications. Excellent communication and interpersonal skills. Ability to multitask and meet deadlines with moderate supervision. Ability to follow safe procedures for working with semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders. Comfort in collaborating with students, faculty, and staff of varying experience and backgrounds. Eligibility to obtain clearance upon request of the US government. Preferred Qualifications Modeling thermal, electrical, or mechanical behavior(s) in packaged devices Characterization of devices and processes, including failure analysis and defect inspection. RF or optical signal integrity. Advanced packaging architectures. Design for reliability and reliability testing. MES and SPC systems. Statistical methods and tools such as JMP, Minitab. Material specification and vendor management. Required License(s) or Certification(s) N/A EEO Statement NC State University is an equal opportunity employer. All qualified applicants will receive equal opportunities for employment without regard to age, color, disability, gender identity, genetic information, national origin, race, religion, sex (including pregnancy), sexual orientation, and veteran status. The University encourages all qualified applicants, including protected veterans and individuals with disabilities, to apply. Individuals with disabilities requiring disability-related accommodations in the application and interview process are welcome to contact View phone number on click.appcast.io to speak with a representative of the Office of Equal Opportunity. Final candidates are subject to criminal & sex offender background checks. Some vacancies also require credit or motor vehicle checks. Degree(s) must be obtained prior to start date in order to meet qualifications and receive credit. NC State University participates in E-Verify. Federal law requires all employers to verify the identity and employment eligibility of all persons hired to work in the United States. #J-18808-Ljbffr NC State University