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Senior IC Packaging Design Engineer for RFIC & SiP

$160k - $225k

SPACE EXPLORATION TECHNOLOGIES CORP

A leading aerospace company in Irvine, CA is seeking an experienced Senior IC Package Design Engineer. This role involves developing next-generation integrated circuits for applications in space and ground infrastructure. Candidates should have at least 5 years of IC package design experience and a Bachelor's degree in electrical engineering. The position offers a competitive salary range of $160,000.00 - $225,000.00 per year, along with comprehensive benefits and opportunities for professional growth. #J-18808-Ljbffr SPACE EXPLORATION TECHNOLOGIES CORP

Vacancy posted 1 day ago
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