Senior SI/PI Engineer — Advanced 2.5D/3D Packaging
Amazon Inc.
Annapurna Labs, an organization within Amazon, is seeking a Sr. Signal & Power Integrity Engineer to drive SI/PI analysis for next-generation machine learning and data center ASIC packaging. You will own the package-level SI/PI strategy, from architecture trade-offs to design closure, measurement, and validation. You will collaborate with ASIC, board, and packaging teams to optimize electrical performance and manufacturing yield across 2.5D/3D-IC packaging, while applying advanced EM/IR analysis #J-18808-Ljbffr Amazon Inc.
Vacancy posted 4 days ago
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