Senior Thin-Film Engineer, Advanced Packaging & R&D
Micron Technology
Micron Technology is seeking an experienced Process Engineer in Boise, Idaho, specializing in thin film deposition for Advanced Packaging R&D. You will develop and optimize deposition processes, collaborating with process integration, yield, and equipment teams to translate ideas into manufacturing-ready solutions. Requirements include an MS/PhD in a related field and 7+ years in advanced packaging with thin film deposition; strong data analysis, DOE, thermodynamics, and kinetics knowledge; plus #J-18808-Ljbffr
Vacancy posted more than 2 months ago
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