Technical Program Manager

## Technical Program ManagerApplylocations: Essex Junctiontime type: Full timeposted on: Posted Yesterdayjob requisition id: JR-2602616**About GlobalFoundries:**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit of Role:**Leads end-to-end program management for Silicon Photonics & Advanced Packaging initiatives, driving cross-functional execution from concept through facility readiness, technology development, and high-volume manufacturing ramp. Ensures alignment & delivers strategic business objectives, customer requirements, and operational excellence targets.**Essential Responsibilities:****Program Leadership & Execution*** Lead Silicon Photonics & Advanced Packaging programs spanning facility design, tool deployment, process development, and technology ramp.* Drive program execution from feasibility through industrialization with clear accountability for milestones, deliverables, and outcomes.* Establish integrated program plans, including macro and micro schedules, critical path tracking, and leading indicators.**Cross-Functional Alignment*** Coordinate across engineering (SiPh Packaging, process integration, equipment), operations, facilities, EHS, supply chain, and external partners (OSATs, tool vendors).* Serve as the central point of integration for Facilities, Packaging Technology teams, IT infrastructure teams & module engineering teams to ensure seamless execution.**CapEx & Financial Management*** Plan, monitor, and control CapEx and OpEx budgets aligned with approved business cases.* Track investment phasing (tranches), tool procurement, and infrastructure readiness against financial targets.**Risk & Issue Management*** Identify program risks across technology, supply chain, facility readiness, and customer commitments.* Drive structured risk mitigation strategies with clear owners and timelines.* Escalate critical risks with data-driven insights and proposed actions proactively**Technology & Manufacturing Readiness*** Partner with engineering teams to ensure readiness for manufacturing maturity and scalability.**Customer & Business Interface*** Engage with key stake holders and internal customers to align program deliverables with market requirements and timelines.**Governance & Communication*** Lead program governance through structured reviews (CCT, executive reviews, technical interlocks).* Provide clear, concise updates to senior leadership, highlighting progress, risks, and decisions required.* Drive follow-up actions and accountability across teams.**EHSS & Compliance*** Ensure all program activities comply with Environmental, Health, Safety, and Security (EHSS) standards.* Promote a culture of safety and operational discipline across all program phases.**Other Responsibilities:** * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.**Required Qualifications:** * Bachelor’s or master’s degree in engineering (Electrical, Mechanical, Materials, or related field); advanced degree preferred.* 10+ years of experience in semiconductor manufacturing, with strong exposure to Fab Operations / Technology Program management, customer management etc.,* Experience in advanced packaging and/or SiPh technologies will be an added advantage* Proven track record of leading large-scale, cross-functional programs (facility build, technology ramp, or new product introduction).* Strong understanding of semiconductor fab operations, packaging flows (wafer-level, die-level, assembly), and equipment ecosystems.**Preferred Qualifications*** **Program Leadership:** Ability to drive execution in high-complexity, high-ambiguity environments.* **Technical Depth:** Strong grasp of manufacturing processes. Experience in Advanced Packaging will be a plus.* **Financial Acumen:** Experience managing multi-million-dollar CapEx programs and business case alignment.* **Risk Management:** Structured, proactive approach to identifying and mitigating risks.* **Executive Communication:** Ability to synthesize complex topics into clear, actionable insights for leadership.* **Collaboration & Influence:** Proven ability to align global, cross-functional teams without direct authority.* **Operational Excellence:** Focus on metrics, discipline, and continuous improvement.**Expected Salary Range**$85,000.00 - $247,000.00The exact Salary will be determined based on qualifications, experience and location.The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.If you need a reasonable accommodation for any part of the employment process, please contact us by email at View email address on click.appcast.io and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. #J-18808-Ljbffr