Lean Manufacturing Engineer

Teledyne Micropac is looking for a Lean Manufacturing Engineer who will provide hands‑on technical leadership to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from engineering handoff through full‑scale production. This role focuses on process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods. Responsibilities Develop, modify, and optimize manufacturing processes from engineering handoff through full‑scale production. Provide hands‑on technical leadership for critical microelectronics processes, including wire bond, epoxy die attach, hermetic sealing, welding, lid attach, leak testing, and assembly. Lead and facilitate DFM reviews, ensuring early and effective collaboration between design engineering and manufacturing. Analyze process and test data to define operating limits, specifications, and control parameters. Plan and execute DoEs, equipment capability studies, and support the introduction of new tools, fixtures, and automation technologies. Support reliability engineering activities including material evaluations, component assessments, failure analysis support, and reliability improvement recommendations. Lead and support continuous improvement initiatives focused on yield, scrap reduction, throughput, cost, and process stability. Apply Lean, Six Sigma, and structured problem‑solving methods to eliminate waste and improve execution. Support organization KPIs to monitor yield, rework, scrap, cycle time, and production readiness. Coordinate cross‑functional efforts for new product introductions, engineering changes, and process improvement projects. Ensure engineering documentation accurately reflects shop‑floor execution and drives execution discipline. Qualifications Associate’s degree in engineering (Mechanical, Electrical, Materials, Industrial, or related discipline) — required 7‑8 years of experience in manufacturing engineering, process development, or continuous improvement — required Hands‑on experience with microelectronics or high‑reliability manufacturing processes such as wire bonding, die attach, hermetic sealing, welding, or precision assembly — required Strong cross‑functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams — required Ability to manage multiple technical initiatives, track actions and risks, and drive timely closure — required Lean Six Sigma Green Belt or similar certification — preferred Working knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies — preferred Experience in aerospace, defense, medical, or other regulated manufacturing environments — preferred Experience using ERP/MRP systems — preferred Benefits A collaborative, mission‑driven work environment Opportunities to grow within a global technology leader Competitive compensation and benefits Paid time off and holidays Retirement savings plans Tuition reimbursement and professional development support What Happens Next Apply online and our recruiting team will review your application. If your background aligns, we’ll reach out to schedule a conversation. We value transparency and will keep you informed every step of the way. Equal Opportunity Employer Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non‑merit based factor made unlawful by federal, state, or local laws. #J-18808-Ljbffr FLIR Systems, Inc.