Product & Component Failure Analysis Engineer (FAE)

Job Description

Job Description

Summary

We are seeking a Product & Component Failure Analysis Engineer. In this role you will be investigating the mechanical, physical, chemical, and different stress factors that lead to a product or component condition, that no longer meets our criteria by systematically examining data and identifying root causes, defect detection and failure analysis to prevent future failures and improve product or component performance.

Job Duties

• Work on failure analysis of Active Optical Cables (AOCs) and identify failure modes, such as physical damage, connector damage, fiber breakage, power supply problems, electromagnetic interference (EMI), poor assembly, signal integrity issues, reflection, and crosstalk.
• Prepare and review monthly TL 9000 measurement data and upload report
• Review customer-reported issues and RMA (return material authorization) cases, database and record maintenance.
• Identify transceiver manufacturing defects, quality control issues, improper termination or poor-quality connectors, and improper soldering or misalignment of components.
• Detect and analyze aging and worn-out key components (Tx & Rx) from degradation.
• Draft comprehensive 8D reports detailing failure causes and recommendations for rectification. Determining root causes using analytical technologies, knowledges and tools.
• Quality Improvement - debugging and writing procedures related to production and field returns. Monitoring products & components performances and correlating issues to improve production yield.
• Communicate the analysis results and put forward corrective suggestions to correlative teams and departments.
• Work with multi-teams for products quality, function and standards specifications

Qualifications

• Bachelor's degree in engineering or a related field preferred Material Engineering/Science, Electronical Engineering, semiconductor, Material Engineering, Material Science, Physics, etc.
• Minimum of one years of in failure analyses of semiconductor laser dies, semiconductor process monitoring, and photonic integration circuit quality control preferred
• Expected skills include exposure to various analytical techniques, such as SEM, EDS, XRD, FIB, TEM, etc.
• Experience in debugging and failure analysis techniques of prototypes and products
• Strong understanding of optical communication principles and standards
• Understanding of processes involved in optical chip and module assembly, alignment, and burn-in processes
• Excellent analytical and problem-solving capabilities including using analysis software and systems
• Knowledge of quality standards, regulations, and GR-468 Generic Reliability Assurance Requirements
• Excellent presentation and reporting skills, good organization and multi-tasking skills and excellent attention to details

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

In addition to competitive salary, AOI offers

• Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs
• Employer matching on 401(k) deferrals
• Generous PTO policy, with unused PTO payout at end of the year
• Relocation package available within US
• Immigration sponsorships (Must be currently authorized to work in the US)

We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.