Manufacturing Process Engineer

Job Description

Job Description

Salary: $100,000

We are seeking a highly skilledManufacture Process Engineerto lead and optimize manufacturing processes forPrinted Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

Key Responsibilities

• Process Development & Optimization
  • Design, validate, and optimizestencil designsfor solder paste application.
  • Develop and maintainreflow soldering profiles, includingvapor phase reflow processes, to ensure robust solder joints and minimize defects.
  • Establish and refinewave soldering profilesfor through-hole components.
  • Define and implementsecondary operationsincluding press-fit connector installation, heat sink attachment, and mechanical assembly steps.
  • Develop and overseeconformal coating processesto ensure environmental protection and product reliability.
  • Create and enforcerework standardsfor soldering, ensuring compliance with IPC and industry best practices.
• Manufacturing Support
  • Provide technical leadership to production teams in troubleshooting assembly issues.
  • Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
  • Drive yield improvement initiatives and root cause analysis for process-related defects.
  • LeadCorrective and Preventive Action (CAPA)initiatives to eliminate recurring issues and strengthen process robustness.
  • Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
• Quality & Compliance
  • Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.
  • Maintain documentation of process parameters, work instructions, and control plans.
  • Partner with quality engineering to implement corrective and preventive actions (CAPA).
• Continuous Improvement
  • Lead projects focused on automation, efficiency, and cost reduction.
  • Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
  • Train and mentor junior engineers and technicians in advanced assembly techniques.

Qualifications & Experience

• Education: Bachelors degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Masters preferred.
• Experience: Minimum710 yearsin PCBA manufacturing engineering, with proven expertise in:
  • Stencil designand solder paste application.
  • Reflow soldering(includingvapor phase reflow) and thermal profiling.
  • Wave solderingprocess development and optimization.
  • Conformal coatingapplication and process control.
  • Secondary operations(press-fit connectors, heat sinks, mechanical assembly).
  • Rework and repair standardsfor solder joints.
  • Root cause analysisandCAPA methodologiesfor troubleshooting and issue resolution.
• Strong knowledge ofIPC standards(IPC-A-610, J-STD-001, IPC-7711/7721).
• Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.
• Demonstrated success inNPI process developmentand scaling to volume production.
• Excellent problem-solving, analytical, and communication skills.
• Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.

Preferred Skills

• Experience withDesign for Manufacturability (DFM)andDesign for Test (DFT)principles.
• Familiarity withLean ManufacturingandSix Sigmamethodologies.
• Proficiency in CAD tools for stencil and fixture design.
• Knowledge of advanced soldering techniques (selective soldering, laser soldering).
• Strong project management and leadership capabilities.