Packaging Module Development Engineer
$115.11k - $219.55kIntel
Job Details:Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will.
- Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
- Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
- Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
- Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
- Manage projects to ensure alignment with product development schedules and execution milestones.
- Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
- Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
- Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
- Technical leadership, strategic planning, and critical thinking.
- Ability to coach and develop technical teams.
- Tolerance for ambiguity and adaptability in a dynamic environment.
- Flexibility in managing changing priorities and responsibilities.
- Experience leading teams in a highly matrixed organization.
- Initiative and ability to work independently.
- Strong communication, influencing, technical, and analytical skills.
$99.03k - $188.89k
Job Details:Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
...Advanced Packaging Technology Manufacturing DivisionThe Advanced Packaging Technology... ...at Intel is responsible for the development and commercialization of industry-leading... ...volume manufacturing.As a Packaging Module Development Engineer, you will:Contribute to the...SuggestedWork experience placementInternshipLocal areaImmediate start$133.8k - $188.89k
...Details:Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization... ...is seeking a Metrology Equipment Engineer to drive process control, manufacturing... ...with equipment suppliers, internal development teams, quality, process, and manufacturing...SuggestedFull timeLocal areaImmediate startShift work$115.11k - $219.55k
...enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and... ...design, material selection and process development to meet those needs, based on fundamental... ...technology development and partner engineering groups on process/technology maturity for...SuggestedFull timeContract workInternshipLocal areaImmediate startShift work$115.11k - $219.55k
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...something wonderful. The Role and Impact Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly... ...'s future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment...Full timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
Intel is seeking an RF Module Development Engineer based in Phoenix, Arizona. In this role, you will drive innovation in analog RF test and design... ...use of advanced lab equipment. A competitive compensation package includes an annual salary range of $115,110 - $219,550,...$133.8k - $188.89k
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