Principal Process Engineer, Die Bonding

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bonding requirements across partner organizations. Responsibilities: Develop, diagnose, and resolve various hybrid bonding process technologies Coordinate and manage process, equipment, and material evaluation/optimization initiatives and implement changes at process step Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits Minimum Qualifications: A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Knowledge and an understanding of project management and experience leveraging AI to design experiments Preferred Qualifications: Masters or Doctorate degree in Engineering, Physics, or related field 5+ years experience in working on Die Bonding in Advanced Packaging settings; Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a Vendor, Research Institute, or Semiconductor Industry Equipment Supplier or Integrator Excellent oral and written communication skills and a strong attention to detail Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visitmicron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on clickmatrix.dev or View phone number on clickmatrix.dev (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. 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