Packaging Engineering Intern - Fall

About the role We’re hiring Semiconductor Packaging Engineering Interns for the fall term. The internship begins in September, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands‑on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply : show us the things you’ve actually built! If you’ve shipped a medium‑to‑high complexity system through a personal project or previous internship, you’d be a good fit here. Responsibilities Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics Collaborate with cross‑functional teams to continuously improve fabrication processes and equipment Hands‑on package/wafer processing (3d printing, metal plating, lithography, metrology) Required Experience Pursuing a Bachelor’s Degree or higher in engineering At least 1‑2 hands‑on wet lab or lab‑adjacent experiences, ideally in metal plating work or fabricating devices Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.) Hands‑on prototyping experience and the ability to move through design cycles quickly Nice‑to‑have Proven experience in mechatronics or electromechanical system design Familiarity with lasering and 3D printing (stereolithography) Reliability testing, soldering, and reflow testing Hands‑on experience with nano‑fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X‑ray, etc.) Working at Atomic Semi We’re an early‑stage hardware startup with solid funding, world‑class advisors, and a lab/office in San Francisco, CA. Atomic Semi is committed to fair and equitable compensation practices. Hardware Interns are paid an hourly rate equivalent to an annualized range of $105,000‑126,000, depending on experience and education level. This range assumes a 40‑hour workweek and includes up to 10 hours of pre‑approved weekly overtime, paid at 1.5x the base hourly rate. Actual earnings will vary depending on internship length and hours worked. Internship Benefits Housing Stipend to help with first month expenses Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts Weekly Learning & Development opportunities Commuter Benefits including Parking and Late Night Uber rides from the office Paid Time Off inclusive of Holidays and Sick Time Visa Sponsorship Medical, Dental, and Vision insurance 401(k) retirement plan Life and Disability Insurance We are an equal‑opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses. Export Control Analysis This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls. #J-18808-Ljbffr Atomicsemi