Mechanical Packaging Design Engineer - Semiconductor
Intel Corporation
Intel Corporation in Phoenix, AZ, is seeking a Mechanical Design Engineer for semiconductor packaging. This role focuses on designing and developing mechanical components and tooling, collaborating with cross-functional teams, and ensuring design manufacturability. Candidates should have a Bachelor's degree in mechanical engineering, familiarity with CAD tools like SolidWorks, and strong communication skills. This full-time position offers a competitive salary and benefits. #J-18808-Ljbffr Intel Corporation
Vacancy posted 6 days ago
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