Senior SI/PI Engineer - 3D/2.5D Chiplet Packaging
University of Texas at Austin
University of Texas at Austin seeks a Principal Signal Power Integrity Engineer to lead comprehensive SI/PI simulations for advanced 2.5D/3.0D heterogeneous integration. You will mentor engineers, collaborate with EDA vendors, OSATs, and foundries, and drive technical strategy for next-gen interfaces. The role requires 12+ years of hands-on SI/PI experience, strong scripting ability, and a track record of delivering package-level models and reference flows. #J-18808-Ljbffr University of Texas at Austin
Vacancy posted 4 days ago
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