LEAD ENGINEER / SENIOR SOFTWARE ENGINEER - PAYMENTS

Lead Engineer / Senior Software Engineer – Payments

FuntoNetwork IT Consulting Empowering Businesses with Innovative IT Solutions

Position Overview

Position: Lead Engineer / Senior Software Engineer – Payments Department: Software Development – Payments Engineering Locations: New Jersey (Berkeley Heights / Edison) OR Charlotte, NC (Hybrid – 3 days onsite per week) Type: Contract, Full‑Time (40+ hours/week) Reports To: Engagement Manager (FuntoNetwork) / Client Payments Architect Tech Stack: Java, Spring Boot, Microservices, Kafka, MongoDB, OpenShift (OCP), Payments Domain Preferred

FuntoNetwork is scaling engineering teams for a flagship payments transformation program at a top‑10 U.S. financial institution. We are hiring multiple Lead Engineers and Senior Software Engineers with strong Java/Spring Boot backgrounds and payments domain experience (preferred). These roles will be embedded in client sites in New Jersey and Charlotte, NC – two of the most significant payments technology centers in the Eastern USA. The hybrid model ensures deep collaboration with client architects, product owners, and QA teams.

Location Requirements:

• New Jersey: Berkeley Heights, Edison, or surrounding areas.
• Charlotte, NC: Uptown, SouthPark, or surrounding areas.
• Hybrid: 3 days onsite per week.

Why These Locations?

• NJ: Proximity to wholesale banking operations, wire transfer systems, and SWIFT processing centers.
• Charlotte: Epicenter of consumer and commercial banking technology; deep talent pool.

Our Payments Engineering practice is dedicated to building the next generation of payment processing platforms – real‑time, cloud‑native, and API‑first. We work on mission‑critical systems handling billions of dollars in transactions daily. In these client‑dedicated roles, you will contribute directly to the modernization of legacy payment applications, implementation of ISO 20022, and adoption of event‑driven microservices.

Key Responsibilities

• Microservice Development: Build scalable, event‑driven microservices using Java 11/17, Spring Boot, and Spring Cloud.
• Event Streaming: Implement Kafka producers, consumers, and stream processors for payment transaction flows.
• Database: Design and optimize MongoDB schemas; work with relational databases (Oracle, SQL Server).
• Container Orchestration: Deploy and manage services on OpenShift (OCP); understand Kubernetes concepts.
• Payments Integration: Integrate with core payment systems (Fedwire, CHIPS, SWIFT, RTP, ACH) – domain experience a strong plus.
• Testing: Write unit, integration, and contract tests; participate in test automation.
• CI/CD: Collaborate with DevOps engineers on pipeline improvements.
• Technical Leadership (Lead Engineers): Guide design decisions, conduct code reviews, mentor junior developers, and contribute to architectural roadmaps.
• Agile Participation: Engage in sprint planning, daily stand‑ups, retrospectives, and demos.

Required Qualifications & Skills

Experience:

• Lead Engineer: 10+ years of software development; 5+ years in Java/Spring Boot microservices.
• Senior Software Engineer: 6+ years of software development; 3+ years in Java/Spring Boot microservices.

Technical Proficiency:

• Java / Spring Boot: Strong expertise.
• Microservices: Proven experience designing and deploying microservices in production.
• Kafka: Hands‑on with Kafka clients, Kafka Streams, or Spring Cloud Stream.
• MongoDB: Experience with NoSQL data modeling and aggregation.
• OpenShift (OCP): Familiarity with container orchestration; ability to deploy and troubleshoot applications.
• REST APIs: API design, OpenAPI/Swagger.

Payments Domain (Preferred):

• Experience with Fedwire, CHIPS, SWIFT, ACH, RTP, FedNow.
• Knowledge of ISO 20022 message formats.
• Familiarity with payment hubs, message transformation, or fraud detection.

Soft Skills:

• Strong communication and collaboration skills.
• Ability to work in a fast‑paced, Agile environment.
• Problem‑solving mindset.

Education: Bachelors degree in Computer Science or related field; equivalent experience considered.

Preferred Qualifications

• Payments domain experience – required for Lead Engineer, strongly preferred for Senior Engineer.
• Experience with event sourcing and CQRS.
• Knowledge of Avro, Schema Registry.
• OpenShift certification.
• AWS / Azure / GCP experience.
• Previous consulting or client‑facing roles.

Why Join FuntoNetwork?

• Mission‑Critical Systems: Work on platforms that move billions of dollars daily.
• Modernization at Scale: Replace legacy mainframe systems with cloud‑native microservices.
• Career Acceleration: Deepen your payments domain expertise; work alongside industry veterans.
• Stability: Long‑term contract with strong likelihood of extension.

Compensation & Benefits

• Hourly Rate:
• Lead Engineer: $80 – $100/hour (W2)
• Senior Software Engineer: $65 – $80/hour (W2)
• Weekly Payroll with direct deposit.
• Benefits Package: Medical, dental, vision, 401(k) with match, paid holidays, accrued sick leave.
• Commuter Benefits: Pre‑tax transit/parking.

Application Process

To apply, please submit:

1. Resume detailing Java/Spring Boot, microservices, Kafka, MongoDB, OpenShift, and payments experience (if applicable).
2. Cover letter addressing: Describe your experience building microservices for a financial or payments system. What were the key architectural considerations?
3. Current location and onsite availability confirmation.
4. HackerRank readiness confirmation.

Submit your complete application package to: Samuel Andoh | Account Manager Email: View email address on click.appcast.io Subject Line: Payments Engineer – [Lead/Senior] – [Your Name] – [Location: NJ/Charlotte]

Visa Status: No H1B sponsorship available. Must be U.S. Citizen, Green Card holder, or possess unrestricted work authorization (W2/Independent Consultant only).

Interview Process (Mandatory):

1. HackerRank Assessment – Java, Spring, microservices coding challenge. FIRST STEP.
2. TP1 – Panel Interview – Technical deep dive (60 min, video).
3. TP2 – Prep Call – Customer discussion readiness review.
4. Customer Interview – Panels available to close same day.

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