Manager of Field Applications Engineering, USA

Manager of Field Applications Engineering, USA Baya Systems is inspired by the baya bird, also known as the weaver. Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient. Baya is a fast‑moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era. We focus on software‑driven, unified fabric solutions for single‑die and multi‑die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System‑on‑Chip (SoC) and multi‑chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals who share our passion for enabling innovation and excellence in the semiconductor industry that empowers game‑changing products and services! Role Overview Lead and grow a world‑class Field Applications Engineering (FAE) team across the USA. Drive the technical adoption, integration, and design‑win pipeline for our next‑generation fabric interconnect silicon IP. Provide both pre‑ and post‑sales support. This is a very hands‑on role with significant individual contribution. Position: Senior Manager, Field Applications Engineering Location: North America Travel: Up to 30% required Key Responsibilities Manage: Lead a distributed team of senior FAEs across the USA. Hire: Recruit and onboard top‑tier engineering talent in key regional hubs. Coach: Provide continuous technical mentorship and professional development. Align: Set clear regional goals aligned with corporate business objectives. Grow collaterals to enable improved efficiency and ease of adoption by the customer. Drive Strategy: Partner with regional sales directors to secure high‑value design wins. Own Delivery: Act as the escalation point for critical customer technical issues. Guide Evaluation: Oversee customer proof‑of‑concepts, evaluations, and architectural reviews. Present: Deliver technical keynotes, deep‑dives, and product demonstrations to C‑level executives. Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management. Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap. Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems. Required Qualifications Experience & Education Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field. Management: 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support). Industry: 10+ years in the semiconductor, silicon IP, or high‑performance networking sectors. Technical Expertise IP Knowledge: Deep understanding of Network‑on‑Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics. Design Flow: Familiarity with front‑end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens). Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements. Soft Skills & Logistics Communication: Exceptional English verbal and written communication skills. Cross‑Cultural: Proven experience managing teams and clients. Autonomy: Self‑motivated style suited for a fast‑paced, early‑stage startup environment. Preferred Qualifications Master’s degree or PhD in Electrical or Computer Engineering. Prior experience working in a fast‑growing, venture‑backed silicon IP startup. Existing technical relationships with major Tier‑1 semiconductor and system companies in the USA. Compensation Salary commensurate with experience. Performance incentives. Equity. #J-18808-Ljbffr Baya Systems