Server Finite Element Analysis (FEA) Engineer

Server Fea Engineer

Qualcomm Data Center team is developing high performance, energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

Our Mission

We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

Key Responsibilities

• Lead multi-scale FEA across package, board, chassis assembly, system, and rack levels
• Own system-level structural simulation, including server chassis assemblies, multi-node integration, and in-rack boundary conditions
• Lead structural dynamics modeling (modal, shock, drop, random vibration, harmonic response, coupled system dynamics)
• Drive platform-level structural architecture through simulation-based decisions
• Correlate analytical models with component-, system-, and rack-level test data
• Define and maintain platform simulation methodologies, modeling standards, and validation frameworks
• Translate simulation into clear design guidance for cross-functional teams
• Present technical analyses to engineering leadership, customers, and suppliers

Qualifications

• Master's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
• Strong background in structural mechanics, materials science, and structural dynamics
• 6+ years of advanced FEA experience in high-tech hardware platforms spanning microelectronics packaging, BGAs/sockets, board-level systems, server chassis assemblies, and full system-level structures
• Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent
• Experience correlating system-level FEA with physical testing (modal, shock, vibration, environmental)
• Strong technical documentation and communication skills
• Proven ability to operate independently and lead within cross-functional teams

Pay range and Other Compensation & Benefits :

$180,500.00 - $270,700.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.