Senior Power SiP & Flip-Chip Packaging Engineer
Renesas Electronics
A leading semiconductor solutions provider in Tempe, Arizona is seeking an experienced engineer to design and develop packaging methods for various applications, including automotive and industrial power. The ideal candidate must possess a relevant degree and 10-15 years of experience in package development, particularly in power SiP/modules. This position offers a hybrid working model, providing flexibility and opportunities for professional growth within an innovative team environment. #J-18808-Ljbffr Renesas Electronics
Vacancy posted 1 day ago
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