Senior Microelectronics Packaging Leader (2.5D/3D)
Jobleads-US
RTX is seeking an Engineering Project Leader to guide microelectronics packaging across 2.5D and 3D heterogeneous integration for RF and mixed-signal subsystems. This onsite role can be located in Tewksbury, MA, McKinney, TX, or Goleta, CA, with responsibilities spanning program capture, technical direction, and cross-functional collaboration.
You will lead trade studies, mentor engineers, and drive proposals while managing portfolio investments. A Top Secret clearance is required to start.
#J-18808-Ljbffr Jobleads-US$157.2k - $298.8k
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$132.4k - $251.6k
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