Printed Circuit Board Design Engineer

Job Description

Job Description

Develop sophisticated multilayer printed circuit boards that support advanced embedded computing platforms for aerospace, defense, and industrial applications. Working alongside electrical, mechanical, manufacturing, systems, and test engineers, you'll transform complex hardware concepts into manufacturable, high-performance PCB layouts while optimizing signal integrity, power integrity, manufacturability, and overall product reliability.

Participate throughout the entire product development lifecycle—from architecture discussions and PCB layout through fabrication support, design reviews, and production—allowing you to solve technically challenging design problems using the latest PCB technologies and industry-leading design tools.

QUALIFICATIONS / REQUIREMENTS

• Bachelor's degree in Electrical Engineering, Electronic Engineering, or related discipline, or equivalent industry experience
• Expertise designing complex high-density multilayer PCBs for aerospace, defense, networking, telecommunications, embedded computing, automotive, or other high-performance electronic products
• 2+ years of professional PCB layout experience using enterprise-class PCB design tools, with Siemens Mentor Xpedition strongly preferred
• Extensive experience with Mentor Xpedition Layout, DxDesigner, and associated design libraries and constraint management tools
• Proven experience translating electrical schematics into manufacturable PCB layouts while collaborating closely with hardware engineers
• Strong background designing high-speed digital PCBs utilizing technologies such as: DDR4 / DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high-speed Ethernet, Controlled impedance routing, Differential pair routing
• Experience designing dense multilayer boards (typically 14–24+ layers, or equivalent complexity)
• Strong knowledge of HDI PCB technologies, including blind/buried vias, via-in-pad, sequential lamination, microvias, and advanced stack-up construction
• Hands-on experience with: BGA, fine-pitch BGA, QFN packages, High-pin-count FPGA layouts, Surface-mount and through-hole technologies, Rigid and rigid-flex PCB designs
• Strong understanding of Signal Integrity (SI), Power Integrity (PI), PCB fabrication and assembly processes, DFM, DFA, and DFT principles
• Experience creating fabrication, assembly, and manufacturing documentation
• Desired
• Experience migrating or translating PCB designs from platforms such as Altium, Cadence Allegro, PADS, Zuken, or PCAD into Xpedition
• Experience supporting engineering libraries, design rule development, ECO management, and PCB design process improvements
• Experience with RF, analog, mixed-signal, and FPGA-based PCB layouts
• Familiarity with impedance-controlled RF structures, antenna layouts, clock distribution, and high-speed memory interfaces
• Experience designing products for aerospace, defense, space, radar, communications, embedded computing, or other mission-critical applications
• Working knowledge of IPC standards, military specifications, and high-reliability PCB design practices
• Experience mentoring PCB designers or establishing PCB design methodologies and best practices
• Strong problem-solving skills with the ability to optimize complex routing challenges while balancing electrical performance, manufacturability, and cost.
• Demonstrated ability to leverage AI-assisted engineering tools to improve productivity while validating engineering accuracy

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