Package & SI/PI - Signal and Power Integrity Engineer

Job Description

Job Description

Join the leading chiplet startup from the ground floor! As a Signal and Power Integrity Engineer, you will provide packaging solutions for chiplet interconnects in a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will be responsible for design, modeling, manufacturing, assembly, and testing of traditional and advanced packaging for Eliyan’s chiplet solutions. You will work with a cross-functional team of industry experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits.

Key Responsibilities

• Working closely with analog circuit designers to understand and define IO requirements co-designed with the channel
• Responsible for pre-layout and post layout channel simulation and optimization to achieve the best performance
• Using driver/receiver models to run transient channel simulation, inspect eye diagrams, and improve the performance
• Applying best practices for the design of power delivery networks, extracting models, and performing DC/AC/transient simulations
• Understanding substrate and interposer manufacturing design rules, assembly requirements, and driving the layout engineers to implement them
• Performing measurements in the lab, correlating with simulation, identifying issues and providing solutions

Qualifications

• Expertise in signal integrity and power integrity simulation methodologies
• Experience with simulation tools such as HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, Allegro
• Knowledge of using lab equipment such as Vector Network Analyzer, Spectrum Analyzer, High-Frequency Oscilloscope
• BS degree in EE or equivalent, with 5 years of experience
• Will not relocate for this role a this time and onsite required

Ideal Qualifications

• Previous experience of IC packaging, manufacturing, and advanced package design
• Knowledge of SERDES design, IBIS-AMI model creation
• MS degree in EE or equivalent, with 7 years of experience

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.