Director, Hardware Engineering

Director, Hardware Engineering

At InspireSemi, we're not just building chips; we're revolutionizing high-performance computing. Our groundbreaking architecture packs thousands of 64-bit CPU cores onto a single chip, all seamlessly connected. We're driven by a mission to make high-performance computing more accessible, energy-efficient, and easier for developers to harness. Ready to make a real impact? Join our passionate team!

We are seeking a Director of Hardware Engineering to lead our silicon development organization. You will oversee the entire hardware lifecycle, from initial architecture and RTL design to physical implementation, DFT, and post-silicon bring-up.

What You'll Do

• Strategic Silicon Roadmap: Own the hardware execution strategy. Make critical decisions on process node selection, third-party IP integration, and package design.
• Team Scaling & Mentorship: Recruit and lead a world class team.
• Hardware-Software Relationship: Partner with the Director of Software to ensure the hardware architecture is optimized for modern HPC workloads and compiler efficiency.
• Execution Excellence: Drive the methodology for multi-site design synchronization, ensuring top-tier verification coverage and first-pass silicon success.
• Vendor & Foundry Management: Manage high-level relationships with foundries, EDA vendors, and IP providers to ensure favorable terms and support.
• Post-Silicon Leadership: Oversee the transition from GDSII to silicon bring-up, working with yield and test engineering to drive high-volume manufacturing readiness.

What You Bring

• Experience: 15+ years in semiconductor engineering, with 8+ years in leadership roles managing complex SoC or CPU projects.
• Advanced Node Expertise: Proven track record leading development cycles for bleeding-edge silicon, specifically at 5nm or below technology nodes.
• Education: A Bachelor's or Master's in Electrical Engineering or Computer Engineering. A PhD is a plus.
• Technical Mastery: Deep expertise in the full Netlist-to-GDSII flow, including high-speed interconnects, memory hierarchies, and power delivery.
• Tape-out Track Record: Proven history of leading multiple successful tape-outs on advanced FinFET nodes.
• Business Acumen: Ability to balance technical perfection with time-to-market pressures and budgetary constraints.
• Influence: A strong reputation in the silicon industry with the ability to attract top-tier talent and negotiate with global partners.

Bonus Points

• Experience with large-scale mesh interconnects or many-core architectures.
• Background in advanced packaging (2.5D/3D IC, Chiplets).
• Direct experience with RISC-V ISA implementation at scale.

If you are a seasoned hardware leader ready to steer the development of the next generation of supercomputing silicon, we'd love to hear from you.