Front End Central Product Integration Engineer - Test & Product Yield Integration (Senior / Sta[...]

Micron Technology is a world leader in memory and storage solutions, accelerating the transformation of information into intelligence.
Job Title

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Key Responsibilities

Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
Integrate and drive execution of cross-site project data (design, test, yield, manufacturing) to closure.
Deliver yield improvements through end-to-end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness ahead of product qualification.
Lead cross-functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best-known methods (BKMs) and business processes to improve productivity.
Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment.
Minimum Qualifications

Bachelor's, Master's, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
Ability to work independently in a cross-functional, global environment, manage multiple priorities, and travel 20–50%.
Preferred Qualifications

Experience with DRAM High Bandwidth Memory (HBM) products.
Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip-package interaction, BEOL integration, or layout topics.
Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
Demonstrated ability to drive alignment and execution in central or network-level roles.
Strong interest in innovation, continuous improvement, and scalable solution development.
Job Profile

FAB Engineer 4
Relocation Level: TBD
Benefits

Micron offers a comprehensive benefits package, including medical, dental, and vision plans, income protection, paid family leave, a robust paid time-off program, and paid holidays.
Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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