Manager, Manufacturing Process Engineering

Teledyne Micropac is looking for a Manager of Manufacturing Process Engineering who will lead a team of process and equipment engineers supporting Micropac’s high‑reliability semiconductor, hybrid microcircuit, and optoelectronic device manufacturing. This role provides on‑site technical leadership, drives process optimization, and serves as the primary escalation point for complex equipment and process issues. Responsibilities Serve as the primary technical escalation point for equipment failures, process deviations, yield excursions, and customer‑driven investigations. Lead structured problem‑solving and ensure high‑quality root‑cause analysis. Provide guidance on semiconductor, microelectronics, and optoelectronic manufacturing processes. Troubleshoot and optimize automated and semi‑automated production equipment. Validate process changes through IQ/OQ/PQ, capability studies, and DOEs. Own critical manufacturing processes, ensuring stability, capability, and documentation. Maintain and improve SOPs, travelers, PFMEAs, control plans, and specifications. Ensure strong document control aligned with AS9100 and aerospace/military standards. Drive continuous improvement to reduce scrap, improve yields, and enhance throughput. Support lifecycle management of critical equipment and obsolescence planning. Coordinate with Facilities and Maintenance to maximize equipment uptime. Manage and develop a team of process and equipment engineers. Assign daily priorities and coach engineers to build technical capability. Promote disciplined engineering practices and data‑driven decision‑making. Manage performance reviews, training plans, and succession development. Partner with Operations, Quality, Planning, Continuous Improvement, and Program Management. Participate in audits, technical reviews, and customer discussions. Qualifications Bachelor’s degree in Engineering (Electrical, Mechanical, Manufacturing, or similar). Or 15+ years of directly relevant manufacturing/engineering experience in lieu of a degree. 7+ years in semiconductor, microelectronics, or aerospace manufacturing – required. Strong knowledge of microcircuit assembly processes and high‑reliability standards – required. Hands‑on experience with equipment troubleshooting, metrology, SPC, and DOE – required. Experience leading technical teams in production environments – required. Strong analytical and diagnostic skills – required. Hands‑on problem‑solving – required. Excellent communication skills – required. Ability to develop engineering talent – required. High sense of urgency and ownership – required. Experience with wire bonding, die attach, hermetic sealing, and hybrid assembly – required. Familiarity with WestBond, K&S, X‑ray inspection, leak detection, and laser tools – advantage. Experience managing CAPEX projects and process improvements – advantage. Benefits Competitive salary and comprehensive benefits. Health, dental, and vision coverage. Retirement savings plan with company match. Paid time off and holidays. Opportunities for professional growth and innovation. A mission‑driven culture focused on exploration and sustainability. Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non‑merit based factor made unlawful by federal, state, or local laws. #J-18808-Ljbffr FLIR Systems, Inc.