Aerospace SMT Soldering Specialist & Rework Technician

We are seeking a highly experienced Solder Assembler with deep expertise in both surface mount technology (SMT) and through hole soldering. The ideal candidate will be proficient in reworking and repairing a wide range of components—including bottom terminated devices such as QFNs, BGAs, and LGAs—using advanced rework equipment and X ray inspection methods. This role supports high mix, low volume production of critical aerospace and defense electronics, requiring meticulous attention to detail and a strong commitment to quality. Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards. Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations. Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings. Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications. Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print” practices where required. Minimum 5 years of handson SMT/TH solder assembly in a highmix, lowvolume environment (aerospace, defense, or similar). Additional certification (e.g., IPCA610, IPCJSTD001) Ability to sit for extended periods and lift to 25 lb (11 kg). Vision acuity (or corrective lenses) sufficient for detailed microscope work. #J-18808-Ljbffr PlanIT Group