Co-Op: Mechanical Packaging Engineer for 3D CAD & Thermal
Nokia
Nokia is seeking a 4-month onsite internship in Sunnyvale, CA or New York, NY for MS/PhD students in mechanical engineering or related fields. You will perform mechanical integrity and thermal simulations, support packaging components, and develop manufacturing drawings using 3D CAD tools. Applicants should have 3D CAD and GD&T experience, DFx knowledge, and strong communication skills to collaborate with engineers and vendors. #J-18808-Ljbffr
Vacancy posted more than 2 months ago
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