VP Engineering, IC Design (On-site. West Lafayette, USA)

Build the silicon brain of the next computing era | VP of Engineering, IC Design | Lead chip teams at Ixana About Ixana Ixana is a Purdue University spinoff developing brain-inspired wearable computing. We've developed Wi-R, a patented wireless communication technology that uses 100x less energy than Bluetooth or Wi‑Fi—streaming high‑speed data through an E‑field bubble around the body. Our 60‑person team is pioneering the first real‑time body‑area‑network platform for wearables, neural sensors, and more. The Wi‑R Revolution Wi‑R enables ultra‑low‑power, high‑bandwidth communication through electric fields instead of radiating RF—making it ideal for body‑worn devices. Imagine transferring data through a touch or enabling real‑time sensing without battery drain. See Wi‑R in action: ixana.ai or watch this demo: Contact Transfer with a Tap The Role: VP Engineering, IC Design We're looking for a visionary leader to build and scale our silicon design organization. You’ll drive innovation, set the technical roadmap, and lead the design and delivery of our Wi‑R chips. This role is critical as we expand Wi‑R into commercial wearables, neural interfaces, and high‑impact edge AI devices. What You’ll Do Lead and grow a world‑class IC design team across analog, mixed‑signal, RF, and digital domains Own the end‑to‑end chip lifecycle—from concept to GDSII to bring‑up and production Set architectural direction and technical standards across IC design projects Work cross‑functionally with hardware, firmware, and product teams to translate chip performance into real‑world applications Guide vendor/EDA tool engagement, IP integration, and tapeout execution Hire, mentor, and retain exceptional engineering talent Represent engineering in executive strategy discussions and technical partnerships What We’re Looking For Required: 10–20 years of experience in analog and mixed‑signal IC design Demonstrated leadership in taking chips from first spec to high‑yield production Deep expertise in design for low‑power, wireless, or wearable applications Experience leading and scaling high‑performance engineering teams Strategic thinker with a hands‑on approach to solving engineering challenges Preferred: Tapeout experience in startups or product‑first environments Familiarity with system‑level design and integration (including firmware/hardware co‑design) Strong communication and stakeholder management skills A track record of mentorship and team development Why Ixana? Work on once‑in‑a‑decade tech: ultra‑efficient, body‑centric communication Lead IC engineering at a company where your designs will ship quickly and globally Collaborate with pioneers in wireless, chip, and embedded system design Build a legacy team and define a new category of computing Location West Lafayette, IN — On‑site at our core R&D and chip design facility (We offer relocation packages for strong candidates.) Ready to Build the Future? Apply now with your resume and a summary of the defense partnerships or acquisitions you've led. Include a brief note on why you’re excited to lead defense strategy at Ixana. Keywords: Semiconductor, RF, Low Power, Wi‑R, Startup #J-18808-Ljbffr