Director of Hardware Platform Design

Seeking a Director of Hardware Platform Design to lead the architecture, design, and execution of advanced hardware packaging platforms from concept through high-volume manufacturing. Own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization. Responsibilities Package Design Strategy : Own the end-to-end package design strategy, including bump/ball map definition, substrate routing architecture, package stack-up, and material selection. Signal & Power Integrity : Lead high-speed and RF signal integrity (SI) and power integrity (PI) architecture, modeling, simulation, and optimization. Thermal & Mechanical Reliability : Direct thermal and thermomechanical analysis, stress modeling, and warpage optimization to ensure package reliability throughout product qualification and mass production. Engineering Leadership: Build and lead multidisciplinary teams across SI/PI, package layout, thermal, and mechanical engineering. Production Test: Partner with Test and Product Engineering to develop comprehensive production test methodologies. System Integration: Lead hardware platform integration across package module, PCB, and system levels. Qualifications Ph.D. in Electrical Engineering (or related field) with 10+ years of industry experience, or M.S. with 14+ years. Expertise in advanced semiconductor packaging, substrate design, and high-density interconnects. Strong knowledge of SI/PI, thermal analysis, and mechanical reliability. Experience with electromagnetic, SI/PI, and thermal simulation tools. Proven success leading multidisciplinary engineering teams and complex hardware programs from concept through production. Strong leadership, communication, project management, and cross-functional collaboration skills. Locations #J-18808-Ljbffr Point2 Technology