Integration Engineer

TITLE: INTEGRATION ENGINEERFLSA STATUS: EXEMPTREPORTS TO: SR. MANAGER, READER INTEGRATIONSUMMARY:Under the direction of the Sr. Manager of Reader Integration, the Integration Engineer is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.ESSENTIAL FUNCTIONS:Develops and delivers process integration and characterization techniques for new technology programs and next generation productsDesigns and conducts experiments to verify process robustness; analyzes data, perform FMEA to meet the product requirements.Works on characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframeConducts failure analysis on newly developed processes and recommends corrective action if necessaryParticipates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframePerforms wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool and CD-SEM to identify defects and provides corrective actions to resolve the issues promptlyReviews and analyzes backend performance data and makes recommendations to improve performanceAnalyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teamsResponds to inquiries from other team members, managers, or departmentsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*MINIMUM QUALIFICATIONS:Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferredThree years of hands on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering roleHands’ on experience using JMP or similar analytical applicationProficient in the use of Microsoft Office ApplicationsRequired Knowledge, Skills, and Abilities:Knowledge of process integration and characterization principles, practices, and techniquesKnowledge of magnetic recording head or HDD manufacturingKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsAble to design experiments, analyze results, and recommend corrective actionAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresAble to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvementsDemonstrated analytical skillsDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritizeWORKING CONDITIONS:The Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.TDK/Headway Technologies, Inc. is an Equal Opportunity Employer. We are committed to providing equal employment opportunities to all employees and applicants and prohibit discrimination, harassment, and retaliation of any kind. Employment decisions are made without regard to race, color, ancestry, national origin, religion, creed, sex, gender, gender identity, gender expression, sexual orientation, age, physical or mental disability, medical condition, genetic information, marital status, military or veteran status, reproductive health decision-making, or any other characteristic protected by federal, state, or local law.Applicants and employees who require a reasonable accommodation to participate in the application process or perform the essential functions of a position should contact the Headway Human Resources Department. #J-18808-Ljbffr