Lead Multi-Physics Packaging Engineer for AI/HPC
$266kOpenAI
OpenAI is seeking an Advanced Packaging Multi-Physics Modeling Engineer to lead modeling and simulation for AI-driven advanced packaging systems. The ideal candidate will enhance power integrity, thermal performance, and reliability of cutting-edge packages. Applicants should have a strong background in multi-physics simulation, thermodynamics, and experience with tools like ANSYS and COMSOL. The position offers a competitive compensation package ranging from $266K to $445K, plus equity options. Join us in pushing the limits of AI technology. #J-18808-Ljbffr
Vacancy posted 5 days ago
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$266k
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