Staff Signal Integrity Engineer - High-Speed Interconnects

Job Description

Job Description

Our client is seeking a Staff Engineer, R&D/Product Development will serve as a senior individual contributor within the Signal Integrity engineering function. This role focuses on the electrical design, modeling, simulation, and validation of high‑speed interconnect products used in advanced communications, datacenter hardware, and wireless infrastructure systems.

The engineer will own signal‑integrity performance from concept through production release, including defining requirements, selecting simulation methodologies, guiding prototype development, and correlating simulation results with lab measurements. This position requires strong technical depth, independent execution, and collaboration with cross‑functional teams across mechanical design, manufacturing, and operations.

Onsite | No Visa Sponsorship | No Relocation Assistance

Please Note: Only local candidates within a reasonable commuting distance of approximately 45 minutes will be considered

Responsibilities:

• Generate actionable recommendations based on simulation results, design reviews, and lab data.
• Support connector, cable, and component qualification activities from a signal‑integrity perspective.
• Act as the subject‑matter expert for signal integrity throughout the product development lifecycle.
• Establish electrical performance and functional requirements for new high‑speed interconnect products.
• Lead prototype evaluation, correlation of simulation and measurement data, and production verification testing.
• Collaborate with global engineering, manufacturing, and operations teams to ensure successful product execution.
• Conduct PCB schematic and layout reviews with emphasis on controlled impedance, routing, stack‑ups, and SI‑critical features.
• Perform signal‑integrity simulations for multiple high‑speed standards, selecting appropriate modeling approaches and interpreting interface‑specific criteria.

Qualifications (Must-Haves)

• Fluent in English, both written and verbal, for global communication.
• Bachelor's degree in Electrical Engineering or equivalent hands‑on experience.
• 8+ years of experience in electrical design, RF design, or PCB design with a focus on signal integrity.
• Proficiency with SI analysis tools such as Agilent ADS, Ansys HFSS, CST Studio Suite, or comparable platforms.
• Strong understanding of electromagnetic theory, transmission‑line behavior, and high‑speed channel performance.
• Familiarity with PCB design, fabrication processes, and assembly considerations.
• Comfortable working across time zones and collaborating with geographically distributed teams.
• Highly motivated, able to learn quickly, and capable of working independently with minimal supervision.
• Ability to interpret simulation and lab data (S‑parameters, TDR, VNA, eye diagrams) and drive corrective actions.

Preferred Skills:

• Strong analytical mindset with a track record of solving complex SI challenges.
• Demonstrated ability to lead technical reviews and influence design decisions across teams.
• Background in connector, cable assembly, radio system, or datacenter hardware development.
• Experience with high‑speed standards such as PCIe, Ethernet, DDR, USB, or SerDes architectures.