RF IC Packaging Design Engineer - High-Performance, AI-Driven

Anysilicon and Amazon Leo collaborate to design IC packages for RF chips used in satellite systems in San Diego. The role focuses on defining floorplans, bump maps, stack-ups, and rigorous 3D simulations to ensure high performance and reliability. You will coordinate with RF designers, vendors, and antenna teams to optimize package options, materials, and thermal management, aiming for volume production readiness.