Packaging Module Process Development Engineer

Job Responsibilities In this position, you will be responsible for advancing packaging process development through the following responsibilities: Develop assembly processes and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimize and improve the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. Develop process and equipment specifications applying principles for design of experiments and data analysis, and document improvements through white papers. Ensure manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures, and flows. Establish material specifications for contract assemblers and raw material vendors and interface with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develop new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Set reliability requirements to meet customer needs and influence design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Lead efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provide consultation concerning packaging problems and improvements in the packaging process and respond to customer/client requests or events as they occur. Deliver standardization in product qualification, manufacturing quality systems, and methods and continuously engage with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones. Behavioral Traits Technical innovation and deliver results for complex, time critical technical projects. Excellent verbal and written communication skills. Qualifications Minimum qualifications: Bachelor's degree in engineering, physics, chemistry or related field with 6+ years of industry experience. Master's degree in engineering, physics, chemistry or related field with 4+ years of industry experience. PhD degree in engineering, physics, chemistry or related field with 2+ years of industry experience. Experience with statistical process controls (SPC). Experience with FMEA and/or DOE. Semiconductor fabrication related experience. Preferred qualifications: Preference for experience with dispense and/or material development. Product ownership, change control management and data systems. Project management and delivering results for time critical technical projects. EEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. #J-18808-Ljbffr Intel Corporation