IC Package Mechanical FEA Engineer (R&D)
$108k - $172.8kBroadcom
Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.. RESPONSIBILITIES:Design responsibility for mechanical design aspects of ASIC packagesUse advanced FEA to quantify and optimize reliability and manufacturingMeasure and experiment to validate understanding and improve model accuracyCollaborate closely with package designers, reliability and manufacturing partners (internal and external) Schedule, prioritize, & track your work across 4+ projects simultaneouslyCreate presentations for and present to various audiences : engineers, managers, senior management, customers, and vendorsDocument design rules and guidelines EDUCATION/EXPERIENCE & REQUIREMENTS:Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions Ability to calibrate modeling and results with existing empirical data Perform mechanical testing and measurementDevise lab scale tests to validate analysesSeek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectationsAnsys Classic/Mechanical experience is preferred. Equivalent tool is OKCooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designersSelf-management and organization skillsPresentation and technical documentation skillsAdditional Job Description:Compensation and BenefitsThe annual base salary range for this position is $108,000 - $172,800. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.SummaryLocation: USA-Colorado-Fort Collins-4380 Ziegler Road; USA-CA San Jose Innovation DriveType: Full time
$168k - $270.25k
...are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure... ...planning & driving related R&D with multiple internal and external... ...Prototyping: Drive the process, mechanical, thermal, and material...SuggestedFull time$2,000 per month
...hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary As a Substrate IC Package Layout Design Engineer you will be responsible for the end‑to‑end...SuggestedWork at officeRelocation package- ...breakthrough technology takes more than great engineering—it takes a team of exceptional people... ...Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership... ...for advanced nodes.Drive SI/PI, thermal, mechanical, and reliability trade-offs at the...Suggested
- ...Overview We are seeking a Systems Packaging & Assembly Engineer to lead the development and... ...responsible for bridging R&D and manufacturing, ensuring... ...MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces. Drive mechanical, electrical, and optical integration...SuggestedContract work
$145k - $255k
...Principal Packaging Design EngineernEye.ai, a well-funded... ...Packaging Design Engineer to lead the development... ...design of the optical and mechanical structures to process implementation... ...integrated circuit (IC) design, mechanical,... ...Element Analysis (FEA) software for stress, thermal...SuggestedContract work- ...seasoned leader to drive its packaging technology. This... ...to create thermally and mechanically stable environments for... ...Optimization: Collaborate with IC design teams to... ...leadership development of engineers and technicians to... ...semiconductor packaging R&D, with at least 5 years...Local area
$155k - $222.6k
...role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation... ...products in the industry within a highly collaborative engineering environment. Responsibilities: • Contribute to package design...Full timeTemporary workLocal areaFlexible hours$117.8k - $200.3k
...reticles, integrated circuits, packaging, printed circuit boards... ...15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...Qualifications The Mechanical Design Engineer will support... ...finite element analysis (FEA). Participate in design...Minimum wageWork experience placementFlexible hours- ...& silicon debuggingscripting for various IC design tasks such as STA, equivalency checks... ...Requirement:B.S degree in EE or computer Engineering. Minimum of 12 years of work experience... ...a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K)...Full timeWork experience placementLocal areaRemote work
$167.3k - $284.4k
...integrated circuits, packaging, printed circuit... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...worldwide semiconductor IC manufacturers. The... ...The Mechanical Design Engineer is... ..., vibrational, and FEA modeling Understanding...Minimum wageWork experience placementWorldwideFlexible hours$136k - $218.5k
...you can make a lasting impact on the world.NVIDIA's Advanced Package Engineering team sits at the intersection of cutting-edge chip design and... ...understanding of VLSI package design along with interposer and IC physical design.Strong expertise in developing package design...Full time$130.17k - $188.49k
...on LinkedIn and X.We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI... ..., Applied Physics, Electrical Engineering, or Mechanical Engineering is required with at least 3 years of industrial...Permanent employmentFull timeWork experience placementFor subcontractorWork at officeDay shiftAfternoon shift$125k - $175k
...Position Summary We are seeking a hands-on Senior Mechanical R&D Engineer to assist with detailed design and development of novel medical... ...documentation input, product verification and validation testing, packaging design and verification, and sterilization and...Full timeFlexible hours$136k - $212.75k
.... To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through... ...design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design...Full timeRemote work$132k - $158k
...Job Title: Sr Packaging Engineer Location : This position is based in our Campbell, California offices. This position is on-site and... ...products. The Sr Packaging Engineer will collaborate closely with R&D, Quality, Regulatory Affairs, Manufacturing, Supply Chain,...Full timeContract workWork experience placementLocal area- ...integrated circuits, packaging, printed circuit... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...worldwide semiconductor IC manufacturers. The... ...an experienced Mechanical Design Engineering... ...Element Analysis (FEA)Tolerance analysisReview...Minimum wageFull timeWork experience placementWorldwideFlexible hours
$103k - $165.6k
...Mechanical Engineer For Strategic Robotics R&D TeamAt Johnson & Johnson, we believe health is everything. Our strength... ...materials, strength of materials, FEA, GD&T)Experience designing and bringing... ...SolidWorks (or equivalent CAD package), including the ability to create models...Temporary workLocal area$124k - $195.5k
...outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology... ...Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced... ...materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates...Full time- ...oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States... ...on schedule while meeting stringent mechanical, electrical, performance, reliability,... ...processes. Partner with Packaging R&D organizations worldwide to define,...Full timeContract workTemporary workWork experience placementRemote workWorldwideFlexible hoursShift work
$141.3k - $240.2k
...reticles, integrated circuits, packaging, printed circuit boards... ...15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...Senior Mechanical Design Engineer will lead... ...projects.Advanced knowledge of FEA, thermal analysis, modal...Minimum wageFull timeWork experience placementFlexible hours$268k - $402k
...Category Engineering Hire Type Employee Job ID 17450 Base Salary... ...industries to maximize their R&D capability and productivity,... ...3DIC silicon IP and advanced packaging design, covering layout, physical... ..., thermal modeling, and mechanical stress analysis for AI infrastructure...Remote workShift work$117.8k - $200.3k
...reticles, integrated circuits, packaging, printed circuit boards... ...15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...motivated Senior Mechanical Engineer to join our RAPID... ...following areas: Structural/FEA analysis Modal &...Minimum wageFlexible hours$116k - $150k
...everything possible.The Senior Mechanical Engineer is responsible for leading... ...Engineering Manager and is part of the R&D Hardware Engineering team... ...finite element analysis (FEA), vibration and modal... ...incentive pay.We offer comprehensive package of benefits including paid...Full time$150k - $250k
TSMC’s Advanced Tool and Module Development Function in R&D is establishing a new engineering team in the US as a direct extension of its organization... ...base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a...Work at office- ...Principal Packaging EngineerWe are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This... ...working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-...Flexible hours
$143.8k - $230k
...verification while collaborating closely with system architects, design engineers, and verification teams. The ideal candidate will have a proven... ....Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation...Full timeLocal area$117.8k - $200.3k
...integrated circuits, packaging, printed circuit... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...worldwide semiconductor IC manufacturers. The... ...seeking a skilled Mechanical Design Engineer to... ...element analysis (FEA).Apply geometric...Minimum wageFull timeWork experience placementWorldwideFlexible hours- ...performance solutions at scale.THE ROLE:The AMD Adaptive and Embedded Computing Group is seeking an experienced and self-motivated package design engineer. As a key member of the Package group, you will work across chip, technology and systems teams to define cost effective and...
$167.5k - $268k
...portions of the advanced packaging and assembly roadmap,... ...technology from early R&D through new product introduction... ...with internal IC design/validation teams... ...Experience with yield failure mechanisms and tools for root‑... ...MSEE in Electrical Engineering or a related field required...Local area$167.3k - $284.4k
...integrated circuits, packaging, printed circuit... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...worldwide semiconductor IC manufacturers. The... ...QualificationsThe Mechanical Design Engineer is... ..., vibrational, and FEA...Minimum wageFull timeWork experience placementWorldwideFlexible hours
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