HBM Memory Subsystem Architect for AI/ML
$177k - $375kMicron Technology Inc
A leading semiconductor company in Boise seeks a Memory Subsystem Architect to design next-generation HBM DRAM products. The role involves collaborating with partners and defining requirements for memory architectures, particularly for AI/ML workloads. Ideal candidates will have 15+ years of experience in memory subsystem design, proficiency with various memory types, and engagement with IP vendors. A strong educational background in Electrical Engineering is essential. Competitive salary range is $177,000 - $375,000 annually. #J-18808-Ljbffr
Vacancy posted 21 hours ago
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