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Lead Package Architect - Semiconductor Packaging & Innovation

Nexperia

Nexperia USA Inc. is seeking a Package Architect in Fort Worth, Texas, to be a subject matter expert in semiconductor packaging. You will formulate package strategies and lead cross-functional teams on new product initiatives. The ideal candidate has extensive experience in semiconductor assembly processes, project management, and a Bachelor’s degree in a related field. The position permits telecommuting up to 3 days a week, reflecting our commitment to flexibility in the workplace. #J-18808-Ljbffr Nexperia

Vacancy posted 3 days ago
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