Microelectronics Engineering Technician - Wire Bonding & Precision Assembly

Job Description

Job Description

Overview

CTG is seeking to fill a Microelectronics Engineering Technician – Wire Bonding & Precision Assembly position for our client.

 

Location: San Jose, CA
Duration: 3 months

 

Duties:

• Perform precision wire bonding, automated bonding, and microelectronic assembly operations.

• Operate and set up wire bonders, auto bonders, furnaces, loaders, and other specialized manufacturing equipment.

• Inspect SMT, PCB assemblies, box builds, electronic components, and microelectronic assemblies using microscopes and magnification tools.

• Perform First Article Inspection (FAI), IPC-610 inspections, lot sampling, pass/fail evaluations, and final product acceptance testing.

• Conduct process testing and validation, including temperature control, peel testing on IC components, and customer simulation testing.

• Verify Bills of Material (BOMs), engineering change notices, manufacturing processes, and production readiness requirements.

• Document inspection results, defects, process deviations, and quality findings in accordance with established procedures.

• Support failure analysis, root cause investigations, process audits, and continuous quality improvement activities.

• Ensure manufacturing and inspection activities comply with engineering specifications, quality standards, and process requirements.

Skills:

• Wire Bonder and Auto Bonder operation

• Precision mechanical tools and instruments

• SMT and PCB assembly inspection

• AOI (Automated Optical Inspection)

• First Article Inspection (FAI)

• IPC-610 standards

• Microscope and magnification inspection

• Electronic component and microelectronics inspection

• Furnace setup, sintering, and loader machine operations

• Process testing and validation

• Peel testing on IC components

• Quality control and quality assurance

• Statistical and lot sampling techniques

• MES and manufacturing process documentation

• Defect detection, identification, and reporting

• Process verification, compliance, and auditing

Experience:

• Minimum 5 years of experience working in a high-tech manufacturing environment, preferably in microelectronics, semiconductor, or medical device manufacturing.

• Hands-on experience operating high-precision mechanical tools and wire bonding equipment is preferred.

• Experience with precision assembly, inspection, quality verification, and manufacturing processes.

• Experience working with microscopes and other magnification tools for detailed component inspection.

• Ability to follow detailed manufacturing procedures, engineering specifications, and quality standards.

• Experience documenting inspection results and supporting failure analysis or root cause investigations.

Education:

• Technical certification, associate degree, or coursework in electronics, microelectronics, manufacturing technology, or a related field is preferred.

Excellent verbal and written English communication skills and the ability to interact professionally with a diverse group are required.

 

CTG does not accept unsolicited resumes from headhunters, recruitment agencies, or fee based recruitment services for this role.

 

To Apply:
To be considered, please apply directly to this requisition using the link provided. Kindly forward this to any other interested parties. Thank you!

 

The expected base salary for this position ranges from $45.00 to $50.00/hour. Salary offers are based on a wide range of factors including relevant skills, training, experience, education, market factors, and where applicable, licensure or certifications obtained. In addition to salary, a competitive benefit package is also offered.