Cooling System Engineer

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Cooling System Engineer to join our engineering team supporting enterprise-class server and storage platforms. In this role, you will be responsible for designing, developing, and validating cooling solutions to ensure optimal thermal performance, energy efficiency, and system reliability in high-performance computing environments. The Cooling System Engineer will collaborate with cross‑functional teams—including mechanical, electrical, and reliability engineers—to design innovative cooling strategies, conduct thermal simulations, and validate system‑level thermal compliance. Job Responsibilities Design and develop cooling solutions for servers, storage, and AI/HPC systems, including air‑cooled and liquid‑cooled architectures. Perform thermal analysis and computational fluid dynamics (CFD) modeling to evaluate airflow, pressure drop, and heat dissipation. Validate thermal and acoustic performance through lab testing, including environmental chambers, wind tunnels, and prototype systems. Collaborate with mechanical and electrical design teams to ensure system integration and compliance with thermal specifications. Define thermal design requirements, specifications, and test methodologies for cooling systems and components. Evaluate new cooling technologies, materials, and manufacturing methods for potential implementation. Support root cause analysis and corrective actions for thermal‑related field or reliability issues. Generate technical reports, design documentation, and presentations to communicate test results and design recommendations. Ensure compliance with industry standards, energy efficiency requirements, and safety guidelines. Work closely with suppliers and manufacturing partners to qualify cooling components and systems. Participate in continuous improvement activities to optimize cost, performance, and manufacturability of cooling solutions. Other duties as assigned. Qualifications Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or related field required. 3–5 years of experience in thermal management, cooling system design, or related field (server, data center, or electronics industry preferred). Strong understanding of heat transfer, fluid dynamics, and thermodynamics. Proficiency with CFD and thermal simulation tools (e.g., FloTHERM, Icepak, ANSYS, or similar). Hands‑on experience with thermal testing and measurement techniques (thermocouples, IR cameras, airflow sensors, etc.). Familiarity with server architectures, high‑density electronics, and data center cooling requirements preferred. Strong analytical and problem‑solving skills with attention to detail. Effective communication and teamwork skills to collaborate across engineering disciplines. Proficiency in Microsoft Office; familiarity with CAD tools (SolidWorks, Creo, or similar) preferred. Must be able to lift up to 50lbs. Reasons you should work for us Comprehensive benefits package including medical, dental, and vision insurance coverage. Basic life insurance and short‑term disability coverage provided by employer. Supplemental life insurance and long‑term disability coverage options available. 401K with employer contribution. Personal, Vacation, and Holiday paid time off for all full‑time employees. Onsite Aurora Health & Wellness Center available for all employees. Employees are continuously encouraged to learn and grow their careers in smart manufacturing. FII USA, Inc is an Equal Opportunity employer. All qualified applicants will receive consideration for employment, without regard to sex, race, color, religion, national origin, age, marital status, political affiliation, sexual orientation, gender identity, genetic information, disability or protected veteran status. We are committed to providing a workplace free of any discrimination or harassment. #J-18808-Ljbffr Foxconn Industrial Internet USA