Senior Package Architect — Early-Phase System Exploration

A leading semiconductor company in Boise, Idaho is seeking a Package Architect to explore advanced packaging architectures for future memory systems. This role involves hands-on design, modeling, and simulating package concepts, focusing on package-level trade-offs, simulations, and defining requirements. The ideal candidate should have a Bachelor's degree with 10+ years of experience in package design or simulation, and strong SI modeling skills. A Master's degree and experience in pre-silicon exploration are preferred. #J-18808-Ljbffr Micron Technology, Inc