Assembler Technician

Job Description

Job Description

Solid State Devices, Inc.

High Density, High Performance, and High Reliability Products for Aerospace & Defense

SSDI has been a pioneer in semiconductor manufacturing for over 50 years and has earned a reputation for setting the highest standards of reliability and performance. SSDI's high power and high voltage semiconductors and electronic systems meet the critical needs of many Aerospace and Defense applications.

Assembler Technician

We are currently seeking motivated Assembler Technicians to join our dynamic team in the Wafer Fab. This is a great opportunity to grow within a high-tech, cleanroom-based manufacturing environment!

As a team member in the Wafer Fab at Solid State Devices, Inc., you will be trained to perform the following tasks:

• Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment
• Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
• Diode Precap Activities - Pre-sealing inspection and preparation of diodes
• Diode Passivation - Application of protective coatings to semiconductor devices
• Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
• Fill Out Manufacturing Process Procedures (MPPs) - Accurate completion of documentation for each production step
• Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures

In addition, you will be trained to perform the following specialized tasks:

• Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
• Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
• Metal Evaporation - Perform thin-film metal deposition using evaporation systems
• Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
• Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
• Wafer Stacking - Carefully handle and stack wafers for processing and transport
• Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
• Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
• Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers
• Diode Test - Perform electrical testing on diodes to verify performance specifications

All tasks include comprehensive hands-on training to ensure safety, accuracy, and process compliance. Comprehensive on-the-job training will be provided.

Education:

• High school diploma or equivalent (GED)
• Basic math skills

Preferred Qualifications

• Microsoft Office Suite (Excel, Word, Outlook)
• 6-months of working experience in a relevant production or manufacturing position

Schedule: Full-time / Monday - Friday / 6:30am - 3:00pm

Starting Salary: $18.50 per hour / Bi-Weekly Pay Schedule (Direct Deposit)

This is not a guarantee of compensation or salary, as final offer amount may vary based on experience.

Solid State Devices, Inc. proudly offers a comprehensive benefits package to all regular full-time employees, which includes:

• Medical, Dental, and Vision Insurance
• Group Life Insurance & AD&D (Accidental Death and Dismemberment)
• Voluntary Term Life Insurance & AD&D
• Paid Time Off (PTO)
• 8 Paid Holidays
• 401(k) Retirement Plan with Company Match
• Roth 401(k)

We are committed to supporting the health, financial security, and well-being of our employees and their families.

Solid State Devices, Inc. is an Equal Opportunity Employer. We consider all qualified applicants for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other legally protected status.

I understand that if I am extended an offer of employment, it will be conditional upon my successfully passing a post-offer, pre-employment Background and Drug Screen.

Upon employment, I agree to the following:

1. Signing an Employee Creation Assignment & Non-Disclosure
2. Abiding by all rules, regulations, and performance standards of Solid State Devices, Inc.
3. Application forms and materials are the property of Solid State Devices, Inc.