Research Scientist

Location: Hoboken, NJ Department: Tomorrow Reports to: Ting Bu Position Overview The Research Scientist will work on the modeling, simulation, and architectural development of quantum and artificial intelligence (AI) computational structures intended for chip-scale implementation. This role focuses on translating advanced quantum and AI concepts into physically realistic, simulation-validated device and system designs suitable for fabrication. It concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under practical fabrication constraints. The role serves as a technical bridge between the research team developing novel quantum/AI architectures and the chip fabrication team responsible for implementation, ensuring that proposed designs are physically realizable, scalable, and performance-optimized prior to tape‑out. Duties and Responsibilities Develop and simulate quantum and AI-based photonic architectures for on‑chip implementation. Translate high‑level computational concepts into device-level and system-level simulation models. Perform rigorous electromagnetic and multiphysics simulations to evaluate optical, nonlinear, and quantum effects. Model and simulate quantum photonic circuits and quantum gates under realistic device conditions. Analyze fabrication tolerances and material constraints to assess design robustness. Optimize photonic device structures for performance, scalability, and manufacturability. Collaborate closely with fabrication and packaging teams to ensure simulation models align with process capabilities. Support post‑fabrication validation by correlating experimental results with simulation predictions. Document modeling methodologies, simulation results, and architectural trade‑offs for internal and external reporting. Required Qualifications Education Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline. Technical Background Strong foundation in Photonics, Quantum optics, Nonlinear optics Demonstrated experience in simulation of photonic integrated circuits. Experience modeling and simulating quantum gates or quantum optical systems. Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient to incorporate realistic constraints into simulations. Familiarity with chip testing and packaging considerations from a modeling perspective. Software Proficiency Lumerical (FDTD, MODE, INTERCONNECT) Tidy3D COMSOL Multiphysics Python MATLAB #J-18808-Ljbffr