Senior Substrate Layout Engineer - Multi-Die Packaging
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Piper Companies seeks a Senior Substrate Layout Designer to lead the design of high-density multi-die substrate packages. You will drive end-to-end physical layout, optimize bump maps, breakout routing, vias, and layer stack-ups, coordinating with ASIC, signal integrity, and power teams.
The role requires 6–8+ years in substrate layout for high-performance IC packaging, with experience in organic substrate design from silicon to BGA and proficiency with Cadence Allegro APD, AutoCAD, or Siemens
#J-18808-Ljbffr Jobleads-USVacancy posted 2 days ago
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