Quantum Topological Qubit Advanced Manufacturing Engineer

About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit Introduction The Topological Qubit AME (Principal Engineer) is a hands-on technical contributor within the Quantum Technology Solutions organization focused on enabling scalable topological quantum computing platforms. This role develops and optimizes semiconductor process modules and materials systems required for topological qubit devices, working closely with device, integration, and materials teams to translate advanced concepts into manufacturable solutions. Summary of Role As a Principal Engineer, this role focuses on development, characterization, and optimization of process technologies supporting topological qubits. The engineer will work across deposition, etch, and epitaxy processes to enable superconducting materials, III‑V heterostructures, and low-loss dielectrics, ensuring robust, repeatable, and scalable manufacturing aligned with device and integration requirements. Essential Responsibilities Develop and optimize process modules including PVD, CVD, ALD, etch, and epitaxial growth (MBE, MOCVD) Engineer advanced materials systems including III‑V heterostructures, superconductors, and low-loss dielectrics Design and execute DOE experiments to evaluate materials, interfaces, and device performance drivers Characterize films using electrical, physical, and structural techniques to assess quality and variability Analyze data to identify key process drivers, defect mechanisms, and optimization opportunities Develop process recipes to meet device requirements, including cryogenic and low-noise performance Support integration of process modules into device and BEOL flows, including superconducting interconnects Collaborate with device and integration teams to align process behavior with device physics requirements Apply SPC and variability analysis to improve process stability, repeatability, and yield Support yield-learning and root-cause analysis activities Document process flows, results, and learnings for knowledge transfer and scale-up Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications BS or MS in Materials Science, Electrical Engineering, Physics, Chemical Engineering, or related field 5–8+ years of experience in semiconductor process or manufacturing engineering Hands-on experience with deposition, etch, or epitaxial processes Strong understanding of semiconductor materials and process–device interactions Experience with materials characterization and data analysis Familiarity with DOE and statistical analysis methods Strong analytical, problem-solving, and communication skills Preferred Qualifications Experience with superconducting or quantum-relevant materials systems Background in III‑V epitaxy and heterostructure engineering (MBE, MOCVD) Familiarity with topological quantum devices or advanced device platforms Experience with BEOL integration, interconnects, or advanced packaging Exposure to cryogenic materials behavior and low-temperature operation Experience with yield improvement, SPC, or variability analysis Experience in advanced R&D or emerging semiconductor technologies Expected Salary Range $85,000.00 - $146,000.00 The exact Salary will be determined based on qualifications, experience and location. 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