Senior Member of Technical Staff (CMP) Engineer

Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing, focused on accelerating technology ramp and manufacturing excellence. The mission is to seamlessly transition cutting‑edge technologies from development to high‑volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). The role requires a seasoned professional who can navigate the complexities of process development, cross‑node standardization, and high‑volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership – Drive module ownership and technical leadership across Intel's most advanced logic technologies. Process Development & Optimization – Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes. Cross‑Node Alignment – Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield. Problem Resolution – Own and resolve complex CMP‑related yield and manufacturing issues using data‑driven approaches and structured problem‑solving methodologies. Strategic Execution – Align technical strategies with customer requirements and business objectives, ensuring on‑time delivery of robust solutions. Technology Transfer – Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production. Continuous Improvement – Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency. Collaboration & Leadership Cross‑Functional Partnership – Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams. Supplier Engagement – Collaborate with equipment and consumables suppliers to co‑develop and optimize CMP solutions. Team Development – Mentor junior engineers and provide technical guidance across the organization. Professional Excellence Proven track record of significant technical accomplishments and successful project delivery. Leadership capability – ability to influence and drive results across multiple organizations and disciplines. Business acumen – understanding of semiconductor industry trends, manufacturing strategies, and customer requirements. Personal Attributes Communication – exceptional ability to communicate complex technical concepts to diverse audiences. Adaptability – thrives in ambiguous situations and can drive clarity in complex technical challenges while working effectively in fast‑paced, high‑pressure environments. Initiative – self‑motivated with strong persistence and ability to work independently. Quality Focus – meticulous attention to detail with commitment to safety, quality, and compliance standards. Qualifications Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field. 7+ years of experience in semiconductor manufacturing / process development or technology development. 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development. Hands‑on process tuning and characterization experience. Experience with major CMP equipment platforms (AMAT, Ebara, etc.) and consumables (slurries, pads, conditioning disks, filters, clean chemistries). Previous semiconductor foundry experience. Preferred Qualifications Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field. Experience with advanced technology nodes (sub‑10nm logic, specifically in Gate‑All‑Around (GAA) architectures) with a track record of successful technology development and HVM implementation. Cross‑functional leadership experience, including task force leadership for yield improvement initiatives. Experience with CMP integration with other process modules (deposition, lithography, etch, clean) and CMP‑relevant metrology. Experience with CMP‑relevant metrology and process control (thickness, topography, defects, roughness, particles). Work Environment This role requires in‑person collaboration to enable rapid decision‑making and effective problem resolution. You will work in a dynamic, fast‑paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction. Impact & Growth Join a team reshaping Intel's foundry capabilities and directly influencing the success of next‑generation semiconductor technologies. This role offers opportunities for professional growth, technical leadership, and meaningful impact on Intel's strategic objectives in the foundry market. Job Details Job Type: Experienced Hire Shift: Shift1 (UnitedStates of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business Group: Intel Foundry Posting Statement (EEO) All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. #J-18808-Ljbffr