Lead Mechanical Design Engineer

As a Lead Mechanical Design Engineer here at Honeywell Aerospace-EDS, you will be a key contributor to the design and development of complex integrated RF\\High speed printed circuit board layouts and advance electronic packaging. Your strong knowledge of mechanical and PCB design principles and methodologies will ensure that the products developed under your leadership meet the highest standards of quality and reliability. Your proficiency in ECAD software and other design tools will enable you to effectively oversee the design process and ensure the delivery of innovative and high-performance electronic solutions.

You will report directly to our Senior Manager of Design Engineering, and you’ll work out of our San Diego location on a 9/8 (Hybrid) work schedule.

In this role, you will Performs independent design and layout tasks for moderate to highly complex integrated RF\\high speed layouts. Generate and revise detailed fabrication and assembly drawings from layouts, and engineering change order. Use established company design guidelines and industry standards utilizing computer-aided design tools such as Xpedition, Altium and PADS software. Adheres to established engineering PCB design practices. Contributes to design modifications to improve the quality of CCA’S or to facilitate manufacturing operations for PCB’S.

At Honeywell Aerospace-EDS, our people leaders play a critical role in developing and supporting our employees to help them perform at their best and drive change across the company. Help build a strong, diverse team by recruiting talent, identifying, and developing successors, driving retention and engagement, and fostering an inclusive culture

KEY RESPONSIBILITIES

• Generate circuit layouts and drawings from engineering inputs (schematics, block diagrams, flow charts).

• Incorporate engineering change orders to designs using Xpedition, Altium or PADS for ECAD, AutoCAD for 2D, SIEMENS NX and SolidWorks for MCAD applications.

• Recommend selection of component hardware, printed circuit board material, tooling and metal material.

• Prepare parts lists and enter parts list data into PLM systems. (Agile + Teamcenter)

• Interface with Engineering to define mechanical assembly approaches for manufacturing and production.

• Understand and support basic engineering calculations for line impedance, temperature rise and voltage drop in RF and DC circuits.

• Actively comply with all company safety policies and practices.

• Participate in Lean/Six Sigma activities in own work area as well as events for other areas to enhance cross-functional problem solving.

• Collaborate in team meetings and activities.

• Performs other job‑related duties as assigned supporting the overall engineering department.

YOU MUST HAVE

• Bachelor’s degree from an accredited institution in a technical discipline such as the sciences, technology, engineering or mathematics

• Eight (8) or more years of related experience designing high frequency products that utilize multilayer mixed mode SMT along with chip and wire (MIC) design approaches.

• Degree in Electrical\\electronics Engineering or equivalent experience in schematic creation and electro‑mechanical layout design. (Associate Degree in Design Drafting with direct related experience acceptable with proven design history)

• A strong knowledge of electronics packaging. Knowledge of MIC (Microwave Integrated Circuit) design, packaging and processes is a plus.

• An understanding of metal fabrication, electronics assembly and electronics manufacturing flow.

• A comprehensive knowledge of ASME Y 14.5 and related drawing specifications.

• A comprehensive knowledge of ASME Y 14.100 and related drawing specifications.

• Expertise in dimensioning and tolerancing. A strong working knowledge of GD&T (Geometric Dimensioning and Tolerancing).

• A comprehensive knowledge of the IPC (Institute for Interconnecting and Packaging Electronic Circuits) 2220 series of standards associated with CCA and PCB design.

• The ability to review and compare engineering inputs and drawings to identify inconsistencies and determine when corrections as needed.

• The ability to work effectively as a part of an integrated design team.

• The ability to be flexible and adapt to changing priorities and work assignments.

• The ability to present information and speak effectively.

• The ability to communicate across organizational levels with quality, integrity and respect.

• The ability to use computer‑aided design software suites including Xpedition, Altium and\\or PADS.

• The ability to use common MS Office software tools and Enterprise‑wide information systems, such as SAP, Teamcenter or Agile, to perform daily job functions.

• The ability to perform design validation and testing to ensure circuit functionality.

• The ability and knowledge to optimize PCB layouts for performance, reliability, and manufacturability.

• Maintain and seek up‑to‑date knowledge of industry standards and technology trends.

• Conduct Design reviews and can effectively present your design to internal design review members.

• Understanding of manufacturing processes and design for manufacturability (DFM) principles.

• Ability to translate 2D\\3D data into circuit elements for library creation and mechanical integration.

• Ability to generate full cam and fabrication documentation.

WE VALUE

• IPC CID+ a plus, Formalized ECAD software training from credited source

• Knowledge of MIC (Microwave Integrated Circuit) design, packaging and processes

• Experience in microwave or millimeter wave electronics packaging design

• Experience with mixed mode, multilayer PCB (Printed Circuit Board) design.

• SAP ERP and Oracle Agile PLM experience, Teamcenter is a plus

• Strong knowledge of the PCB fabrication and assembly process

• Experience working with outside vendors during the PCB design and assembly phase to ensure design feasibility and product quality.

• Siemens ECAD\\MCAD tool set knowledge such as Xpedition Flow, NX modeling and Valor NPI. Altium Designer, Pads Standard Plus layout and Logic.

• 2D AutoCAD along with 3D modeling software such as SolidWorks, Creo or NX

COMPENSATION AND BENEFITS

The annual base salary range for this position is $143K - $180K. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.

Beyond a performance-driven salary, you'll work alongside dedicated experts