Principal ESD Engineer

Renesas is seeking a recognized ESD expert to drive ESD methodology, IP development, and sign-off verification for advanced semiconductor products, including FinFET technologies and high-speed interfaces. Key Responsibilities: Design and optimize custom ESD protection devices, clamps, and ESD IP solutions. Provide co-design support to maximize both performance and ESD protection robustness. Lead ESD sign-off reviews and risk assessments for complex SoCs and mixed-signal products. Develop and maintain automated ESD verification methodologies and flows. Support silicon characterization using HBM, CDM, TLP, VF-TLP, and Latch-Up testing. Drive root-cause analysis of ESD-related failures and implement corrective actions. Collaborate with foundries, EDA vendors, and internal design teams. Qualifications M.S. or Ph.D. in Electrical Engineering or related field. 10+ years of semiconductor ESD design experience. Strong knowledge of: ESD device physics, HBM, CDM, TLP, VF-TLP, Latch-Up, Advanced CMOS and FinFET technologies. Hands-on experience with ESD protection design for FinFET SoCs and SerDes products. Hands-on experience in ESD cell design and custom ESD IP development. Strong knowledge of ESD sign-off methodologies and verification techniques. Experience with Calibre PERC or equivalent ESD verification tools. Proven ability to develop and deploy ESD methodologies across multiple product families and technology nodes. Demonstrated leadership experience in complex cross-functional engineering environments. Strong initiative, collaboration, and ownership, with a proven track record of driving results under aggressive timelines. Strong technical writing skills with the ability to produce clear technical reports, design reviews, and engineering recommendations. Strong communication skills with the ability to effectively communicate technical risks, recommendations, and methodologies across global teams including Japan, Europe and Asia. Preferred Qualifications: Experience supporting advanced-node AI, HPC, networking, memory, or data-center products. Experience with IEC/EMC or system-level ESD considerations. Additional Information Additional location for consideration for this position is Palm Bay, Florida. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas. #J-18808-Ljbffr Renesas