Senior Principal Engineer-Thermal Controls Strategy and Architecture

Infrastructure Solutions Group (ISG) builds the products that power infrastructure, solutions, and data management our customers need most. Our teams design and develop the hardware and software that connect infrastructure, accelerate computational workloads, integrate across the stack, protect data continuity, and deliver the platforms, applications, and diagnostics our customers rely on every day at enterprise scale.Some product builders follow the rules. Ours rewrite them.Within ISG, innovation isn't just about creating new technology- it's about challenging assumptions and reimagining how work gets done. Engineers define intent, author precise specifications, and orchestrate AI agents that execute at speed and scale. AI is embedded throughout our development process, helping us move faster, learn quicker, and deliver greater impact. Yet the most important contribution remains uniquely human: deciding what to build, designing how it should work, and applying the judgment needed to earn our customers' trust. When your products power critical infrastructure around the world, that responsibility matters.We move quickly toward the work that matters most. We reward experimentation, encourage bold thinking, and remove unnecessary barriers so great ideas can become reality faster. Our teams embrace a customer-first, first-to-market mindset, transforming rapid feedback into better products and better outcomes. We aren't looking for people who are content with the status quo- we look for builders who question it, improve it, and occasionally rewrite it.If you're energized by solving complex systems challenges, excited to work alongside AI to amplify hermal Controls Strategy and ArchitectureThermal Engineering leads and delivers the development of innovative and compliant thermal design solutions, as well as cross-functional interfaces for computer systems and peripherals. Our team conducts the analysis, feasibility studies and testing of thermal products, instruments, subassemblies and packaging for new and existing products – and then oversees the introduction of design changes to the manufacturing organizations.W