Director of Package Design

Microsoft Silicon Cloud Hardware and Infrastructure Engineering ( SCHIE ) is the team behind Microsofts expanding Cloud Infrastructure and responsible for powering Microsofts Intelligent Cloud mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over 200 online businesses including Bing MSN Office 365 Xbox Live Teams OneDrive and the Microsoft Azure platform globally with our server and data center infrastructure security and compliance operations globalization and manageability solutions. Our focus is on smart growth high efficiency and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design development manufacturing and packaging of Microsofts state-of-the-art computer chips notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.

As Microsofts cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time in high volume with high quality and lowest cost is of paramount importance. To achieve this goal the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing improving the planning process quality delivery scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Director of package design to join the team to support our mission as a key leader of the advanced packaging design team.

#SCHIE #CSME #SMPE

• Lead and mentor a team of talented package design engineers supporting their career growth and professional development.
• Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
• Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
• Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition development to tapeout
• Define design and develop test vehicles to validate Silicon Package System performance.
• Drive supplier assessments and manage suppliers through definition development qualification and production.
• Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
• Define EDA tools requirements for advanced 3DIC packaging designs
• Design and develop package and assembly drawings to support the manufacturing.
• Lead supplier assessments and manage suppliers through definition development qualification and production.
• Assess and characterize the reliability of Integrated Circuits (IC) packages.
• Design and develop package and assembly drawings to support the manufacturing.
• Work closely with silicon and platform architects motherboard and package designers thermal architects and engineers and power and performance engineers.
• Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise industry best practices and lessons learned from teams working across multiple product lines.
• Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Required Qualifications:

Doctorate in Electrical Engineering Computer Engineering Computer Science or related field AND 3 years technical engineering experience OR Masters Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 6 years technical engineering experience OR Bachelors Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 8 years technical engineering experience OR Equivalent Experience.

Other Requirements

• Ability to meet Microsoft customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• This role will require access to information that is controlled for export under export control regulations potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations the EU Dual Use Regulation and/or other export control a condition of employment the successful candidate will be requiredto provide either proof of their country of citizenship or proof of their US. residency or other protected status(e.g. under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled meet this legal requirement and as a condition of employment the successful candidates citizenship will be verified with a valid passport. Lawful permanent residents refugees and asylees may verify status using other documents where applicable.

Preferred Qualifications:

• Doctorate in Physics Electrical Engineering Computer Engineering Computer Science Chemistry or related field AND 10 years technical engineering experience OR Masters Degree in Physics Electrical Engineering Computer Engineering Computer Science Chemistry or related field AND 15 years technical engineering experience OR Bachelors Degree in Physics Electrical Engineering Computer Engineering Computer Science Chemistry or related field AND 18 years technical engineering experience OR equivalent experience.
• 15 years of hands-on experience in Semiconductor Package design development manufacturing supplier management or quality management
• Experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
• Foundation in advanced packaging technologies manufacturing and supplier management
• Proficient in IC package or PCB board layout CAD tools Cadence Allegro*
• Working knowledge in high-speed signaling layout electrical mechanical and thermal co-designs.
• Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis
• Experience with OSAT Supplier & Foundry technologies.
• Experience in physical failure analysis
• Experience in subcontract supplier management.
• Experience in cross-functional team environment

Silicon Engineering M5 - The typical base pay range for this role across the U.S. is USD $142800 - $274800 per year. There is a different range applicable to specific work locations within the San Francisco Bay area and New York City metropolitan area and the base pay range for this role in those locations is USD $188000 - $304200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
position will be open for a minimum of 5 days with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age ancestry citizenship color family or medical care leave gender identity or expression genetic information immigration status marital status medical condition national origin physical or mental disability political affiliation protected veteran or military status race ethnicity religion sex (including pregnancy) sexual orientation or any other characteristic protected by applicable local laws regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process read more about requesting accommodations.

Required Experience:

Manager